Light Emitting Diode
This document contains tentative information, Nichia may change the contents without notice.
8/14
SP-QR-C2-220184-1
Jun. 8, 2022
Assembly Precautions for the Nichia 193F Series LEDs
Recommended Soldering Pad Pattern
Recommended Metal Solder Stencil Aperture
Pattern Recommended in the Specification
Modified Pattern
4
(Unit: mm)
(Unit: mm)
(Unit: mm)
Item
Recommended Conditions
Metal Solder Stencil
(Thickness)
120μm
Solder Paste
(Composition)
Sn-3.0Ag-0.5Cu
Center of the Soldering Pad
Pattern
Metal Solder Stencil Aperture
Soldering Pad Pattern
3. Design Recommendations for Optimal Amount of Solder
Soldering Pad Pattern/Metal Solder Stencil Aperture
Table 7. Recommended Soldering Pad Pattern/Metal Solder Stencil Aperture
3
Table 8. Recommended Solder/Metal Solder Stencil Conditions
3
6 .8
0 .5
2
.1
7
.3
5
1
.2
12
.3
4
.0
5
6 .8
0 .5
0 .3
0
.3
6
3
.3
3
3
.1
5
0
.1
5
12
.3
5 .2
2
.6
3
.5
5
12
.3
2
.3
5
6
.5
5
0 .5
1 .5
5 .8
6 .8
0
.4
2-C0 .8
4-C0 .5
2-C0 .5
Electrodes and Die Heatsink
Package Outline
3
The recommended soldering pad pattern, metal solder stencil aperture, and thickness
of the metal solder stencil provided in Tables 7 and 8 have been determined under
Nichia’s conditions: ensure that there are no issues with the chosen assembly conditions
prior to use.
4
If the aperture is large, the solder paste may not be applied evenly (i.e. thinner for the
middle area of the aperture) in the solder printing process causing the amount of the
solder paste applied to the soldering pad pattern to vary for each operation. This
modified pattern has four small apertures for the die heatsink instead of one large
aperture while the total area of the aperture is almost the same as that for the pattern
recommended in the specification.
