Light Emitting Diode
This document contains tentative information, Nichia may change the contents without notice.
13/14
SP-QR-C2-220184-1
Jun. 8, 2022
Assembly Precautions for the Nichia 193F Series LEDs
120sec Max
Pre-heat
180~200
℃
260
℃
Max
10sec Max
220
℃
Max
60sec Max
1~5
℃
/sec
5. Precautions When Reflow Soldering
Figure 9. Recommended Reflow Soldering Condition
(Lead-free Solder)
1. Reflow soldering must not be performed more than twice.
2. Nichia recommends using the reflow soldering conditions detailed in Figure 9
to the left; use the recommended reflow conditions specified by the
manufacturer of the solder paste being used if it works better for the chosen
application.
Note: To ensure that these reflow conditions have no negative effect on the
LEDs, perform sufficient verification prior to use.
3. When cooling the LEDs from the peak temperature a gradual cooling slope is
recommended; do not cool the LEDs rapidly.
4. During reflow soldering, the heat and atmosphere in the reflow oven may cause
the optical characteristics to degrade. In particular, reflow soldering performed
with an air atmosphere may have a greater negative effect on the optical
characteristics than if a nitrogen atmosphere is used; Nichia recommends using
a nitrogen reflow atmosphere.
