Nichia 193F Series Assembly Download Page 7

Light Emitting Diode

This document contains tentative information, Nichia may change the contents without notice.

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SP-QR-C2-220184-1

Jun. 8, 2022

Assembly Precautions for the Nichia 193F Series LEDs

Caution: Do not touch the 

prohibited area.

Suggestion: Grab/hold the LEDs with 

tweezers by the package.

2.1 Prohibited area

Do not touch the prohibited area shown in Figure 1. This may cause the LED malfunction (e.g. the LED not to 

illuminate).

2.2 Handling with bare hands

Do not handle the LEDs with bare hands:

- this may contaminate the LED surface and have an effect on the optical characteristics,

- this may cause the LED to deform or to be damaged causing a catastrophic failure (i.e. the LED not to 

illuminate),

- the electrodes and/or the die heatsink may cause injuries when the LED is handled with bare hands.

2.3 Handling with tweezers

Ensure that when handling the LEDs with tweezers, grab/hold the LEDs by the package (i.e. the black part) and 

ensure that excessive force is not applied to the LED. Otherwise, it may cause damage to the LED (e.g. cut, 

scratch, chip, crack, etc.) and have an effect on the optical characteristics and/or the reliability. See Figure 2.

2.4 ESD Precautions

The LEDs are sensitive to transient excessive voltages (e.g. ESD, lightning surge). If this excessive voltage 

occurs in the circuit, it may cause the LED to be damaged causing issues (e.g. the LED to become dimmer or 

not to illuminate [i.e. catastrophic failure]). When handling the LEDs, ensure that necessary measures have 

been taken to protect them from transient excess voltages. 

2.5 Stacking assembled PCBs together

Do not stack assembled PCBs together. Otherwise, it may cause damage to the LED (e.g. cut, scratch, chip, 

crack, etc.) and have an effect on the optical characteristics and/or the reliability.

2.6 Storage

The storage/packaging requirements for the Nichia 193F Series LEDs are comparable to JEDEC Moisture 

Sensitivity Level (MSL) 2 or equivalent. Nichia used IPC/JEDEC STD-020 as a reference to rate the MSL of the 

LEDs. Table 6 shows the required storage conditions for the LEDs.

Conditions

Temperature

Humidity

Time

Storage

Before Opening Aluminum Bag

≤30

≤90%RH

Within 1 Year from Delivery Date

After Opening Aluminum Bag

≤30

≤70%RH

Within 1 Year

Figure 2. Correct/Incorrect Examples    

of Handling with Tweezers

Figure 1. Prohibited area

Prohibited 

area

2. Handling Precautions

Table 6. Storage Conditions

Correct

Incorrect

Summary of Contents for 193F Series

Page 1: ...rt numbers within this document are merely Nichia s part numbers for those Nichia products and are not related nor bear resemblance to any other company s product that might bear a trademark 2 6 7 8 9...

Page 2: ...5 2 8 Cathode Mark 0 2 A 0 2 B 1 8 Max 0 5 0 9 1 27 Item Package Materials Description Black Heat resistant Polymer Electrodes Materials Die Heat Sink Materials Au plated Copper Alloy Phosphor sheet M...

Page 3: ...9 8 9 Cathode Mark 0 2 B 0 2 A 1 27 0 5 0 9 1 8 Max Item Package Materials Description Black Heat resistant Polymer Electrodes Materials Die Heat Sink Materials Au plated Copper Alloy Phosphor sheet M...

Page 4: ...contain the products having the following ribbon shapes 1 Shape1 2 Shape2 Unit mm This product complies with RoHS Directive RoHS Unit mm Tolerance 0 1 No STS DA7 17846A Part No NC3W193F The dimension...

Page 5: ...0 05 Cathode Mark 0 2 A 0 2 B 1 27 0 5 0 9 1 8 Max Item Package Materials Description Black Heat resistant Polymer Electrodes Materials Die Heat Sink Materials Au plated Copper Alloy Phosphor sheet Ma...

Page 6: ...s do not include mold flash or metal burr It may contain the products having the following ribbon shapes 1 Shape1 2 Shape2 Unit mm This product complies with RoHS Directive RoHS Unit mm Tolerance 0 1...

Page 7: ...ptical characteristics and or the reliability See Figure 2 2 4 ESD Precautions The LEDs are sensitive to transient excessive voltages e g ESD lightning surge If this excessive voltage occurs in the ci...

Page 8: ...lder Metal Solder Stencil Conditions3 6 8 0 5 2 1 7 35 1 2 12 3 4 05 6 8 0 5 0 3 0 3 6 3 3 3 3 15 0 15 12 3 5 2 2 6 3 55 12 3 2 3 5 6 55 0 5 1 5 5 8 6 8 0 4 2 C0 8 4 C0 5 2 C0 5 Electrodes and Die Hea...

Page 9: ...ly before pick up See 4 2 Tape and Reel Feeder on Page 11 for details Nozzle height for pick up operations The contact surface of the nozzle head for pick operations should be adjusted to 1 05mm below...

Page 10: ...o an incorrect pick up i e the LED is picked up in a tilted position 2 When setting the LED pick up position ensure that the center of the nozzle and the center of the LED are aligned and that the noz...

Page 11: ...Embossed Carrier Tape Pocket LED 4 2 Tape and Reel Feeder Figure 5 Recommended Top Cover Tape Removal Position 4 3 Recommended Nozzle Height for Pick up Operations Figure 6 Recommended Nozzle Height...

Page 12: ...become damaged 1 Nichia recommends using the electrodes and die heatsink as a reference to locate the center of the LED 2 If the imaging device has trouble detecting recognizing the electrodes die hea...

Page 13: ...the recommended reflow conditions specified by the manufacturer of the solder paste being used if it works better for the chosen application Note To ensure that these reflow conditions have no negati...

Page 14: ...llectual property rights or other rights held by Nichia or third parties Nichia makes no representation or warranty express or implied as to the accuracy completeness or usefulness of any information...

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