Nexperia AN10343, Application Note, Page: 30 / 32

Nexperia
AN10343
MicroPak soldering information
List of Tables
Table 1. Overview MicroPak packages................................3
Table 2. Typical solder paste characteristics........................5
Table 3. Pb-free process - Package classification
reflow temperatures (from J-STD-020D)..............................5
Table 4. Typical stencil thicknesses.....................................6
Table 5. Typical placement accuracies................................ 6
Table 6. Explanation of the reflow temperature profile......... 7
Table 7. Revision history....................................................28
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Nexperia B.V. 2021. All rights reserved
application note Rev. 3.0 — 31 May 2021 30 / 32