Nexperia AN10343, Application Note, Page: 2 / 32

Nexperia
AN10343
MicroPak soldering information
1. Introduction
Nexperia Semiconductors’ PicoGate and MicroPak packages are approximately ten to fifteen
times smaller than conventional SO14 packages, providing significant miniaturization in space-
constrained applications. They are available in a wide range of logic functions with a wide range of
choices and deliver the right levels of performance.
PicoGate and MicroPak devices include single-, dual-, and triple-gate functions and are housed
in 5-, 6-, 8- and 10-pin packages with selectable functions. To support the widest range of
applications, every product in the portfolio is specified for high-temperature operation (-40
°C to +125 °C). Since they perform the most popular functions and either meet or exceed
competitive specifications, they eliminate single-source problems.
Driven by applications with a very small circuit board mounting area, the PicoGate logic family
offers the most popular logic functions for space-constrained systems such as cellular phones,
pagers, and portable consumer products (CD players, VCRs, cameras, hard disks, notebook
computers, PC cards, CD ROMs, and Personal Digital Assistants (PDAs)). They can also be used
as simple glue/repair logic to implement last minute design changes or to eliminate dependence on
intricate line layout patterns and to simplify routing.
This application note describes the following mounting methods for MicroPak packages:
• MicroPak footprint
• SOT886/833-1 MicroPak on WLCSP/BGA footprint and vice versa
• SOT996-2 MicroPak on VSSOP8 footprint and vice versa
2. MicroPak overview
2.1. Package description
The MicroPak package is a near Chips Scale Package (CSP) Land Grid Array (LGA) type plastic
encapsulated package with a copper lead frame base. The package has no leads or bumps with
peripheral land terminals at the bottom of the package. The terminals are soldered to solder lands
on the Printed-Circuit Board (PCB), after solder paste is deposited.
An overview of released MicroPak packages is given in
Table 1 .
AN10343 All information provided in this document is subject to legal disclaimers.
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Nexperia B.V. 2021. All rights reserved
application note Rev. 3.0 — 31 May 2021 2 / 32