Nexperia AN10343, Application Note, Page: 7 / 32

Nexperia
AN10343
MicroPak soldering information
019aab067
t
ph
β
χ
t
r
T
p(max)
temperature
time
T
ph(min)
α
T
ph(max)
T
r(max)
T
p(min)
t
ph
time to peak
Fig. 1. Example of a general purpose Pb-free reflow profile
Table 6. Explanation of the reflow temperature profile
Parameter Value(s) Typical value(s) Remark
α 1 °C/s to 5 °C/s 2 °C/s determined by component and board type and finish
ß 1°C/s to 5 °C/s 1.5 °C/s determined by component and board type and finish
X -2 °C/s to +6 °C - determined by component and board type and finish
T
ph(min)
to
T
ph(max)
120 °C to 200 °C 160 °C depends on the solder paste used - contact your
solder paste supplier
t
ph
0 s to 180 s 100 s to 180 s depends on the solder paste used - contact your
solder paste supplier
t
r
30 s to 90 s 40 s to 70 s depends on board finish and solder paste voiding
behavior - contact your board and solder paste
supplier
T
p(min)
235 °C - temperature measured in the solder at the coldest
spot [1]
T
p(max)
260 °C 245 °C depends on the board and the board finish in case of
OSP and the most temperature-sensitive component
used on the board [1]
reflow atmosphere - - general purpose reflow is under air atmosphere,
nitrogen reflow is allowed
[1] Delta between T
p(min)
and T
p(max)
preferably limited to 10 °C.
Additional soldering information and guidelines for board-mounting of surface-mount IC packages
are described in
AN10365
‘
Surface mount reflow soldering description
’.
3.6. MicroPak soldering information for WLCSP/BGA footprint
Fig. 2 shows the recommended solder land pattern for mounting the MicroPak XSON6 (SOT886)
package. Using this pattern results in a very good electrical and mechanical connection which can
also be inspected and tested for continuity. Using the land grid array package eliminates the co-
planarity issues of leaded and WLCSP/BGA type devices.
The 6-pad MicroPak package available from NXP Semiconductors is alternately second-sourced
by Fairchild Semiconductors. Although the footprint for the Texas Instruments WLCSP/BGA
package is physically smaller, the MicroPak very easily fits the same footprint. Fig. 3 shows the
AN10343 All information provided in this document is subject to legal disclaimers.
©
Nexperia B.V. 2021. All rights reserved
application note Rev. 3.0 — 31 May 2021 7 / 32