Nexcom EBC 300 Series, User Manual

Page: 9 / 22

EBC 300 User’s Manual 9 Chapter 1
Environments
- Board-level operating temperatures: -20°C to 60°C
- Storage temperatures: -20°C to 80°C
- Relative humidity: 10% to 90% (Non-condensing)
Certification
- CE
- FCC Class A
Ordering Information
EBC 300-C65-256M
3.5”
Low Power Embedded Board with Celeron M 600MHZ 512KB L2 on Board with VGA/
LVDS/Audio/COM/ USB2.0 / Gigabit LAN
EBC 300-SKT-256
3.5”
Low Power Embedded Board with Pentium M / Celeron M CPU Socket with VGA/
LVDS/Audio/COM/ USB2.0 / Gigabit LAN
1.3 Power Consumption Measurement
Power Requirement:
System Configuration OS: WinXP / Memory: 256MB / Storage: 40GBTest
Program : K Power + Burning Test
Voltage +5V
(A)
+12V
(A)
+5Vsb
(A)
-12V
(A)
Theoretical Current:
R&D Design Max. Power Loading
14.6A 1.176A 0.3A 0.235A
Heavy :
Maximum HD/CPU and Memory Loading
7A
0.05A (AT)
0.05A (ATX)
0.20 (ATX) For PC/104
Normal: ( without K power test )
25% HD / 70% CPU and 50% Memory Load
3.14A (AT)
3.13A (ATX)
0.05A (AT)
0.05A (ATX)
0.20A (ATX) N/A
Idle:
OS in idle state
2.96A (AT)
2.94A (ATX)
0.05A (AT)
0.05A (ATX)
0.19A (ATX) N/A
Note: -12V is reserved for PCI-104 expansion requirement, the table only show the R&D design max. power support