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GQM22M5C2H300JB01_ (1111, C0G, 30pF, 500Vdc)

_: packaging code

Reference Sheet

1.Scope

  

2.MURATA Part NO. System

(Ex.)

3. Type & Dimensions

(Unit:mm)

4.Rated value

5.Package

Product specifications in this catalog are as of Jan.30,2013,and are subject to change or obsolescence without notice.
Please consult the approval sheet before ordering.
Please read rating and !Cautions first.

1.0 min.

(2) T

1.15±0.2

This product specification is applied to RF High Frequency Chip Monolithic Ceramic Capacitor used for RF High frequency
Electronic equipment.

(1)-1 L

2.8±0.5

(1)-2 W

2.8±0.4

e

±5 %

-55 to 125 °C

0±30 ppm/°C

25 to 125 °C

(25 °C)

(3) Temperature Characteristics

(Public STD Code):C0G(EIA)

Specifications and Test

Methods

(Operationg

Temp. Range)

Temp. coeff

or

 

Cap. Change

(5) Nominal

Capacitance

(6)

Capacitance

Tolerance

500 Vdc

30 pF

Temp. Range

(Ref.Temp.)

(8) Packaging

mark

(4)

DC Rated

Voltage

Packaging Unit

RF HIGH FREQUENCY CHIP MONOLITHIC CERAMIC CAPACITOR

g

0.3 min.

L

f

180mm Reel

EMBOSSED W8P4

1000 pcs./Reel

K

f

330mm Reel

EMBOSSED W8P4

4000 pcs./Reel

(1)L/W

Dimensions

(2)T 

Dimensions

(3)Temperature 

Characteristics

(4)DC Rated 

Voltage

(5)Nominal 

Capacitance

(6)Capacitance 

Tolerance    

(8)Packaging 

Code 

(7)Murata’s 

Control Code                             

T

L

W

e

e

g

GQM

22

M

5C

2H

300

J

B01

L

GQM22M5C2H300JB01-01

1

Summary of Contents for GQM22M5C2H300JB01 Series

Page 1: ...ipment 1 1 L 2 8 0 5 1 2 W 2 8 0 4 e 5 55 to 125 C 0 30 ppm C 25 to 125 C 25 C 3 Temperature Characteristics Public STD Code C0G EIA Specifications and Test Methods Operationg Temp Range Temp coeff or...

Page 2: ...f the terminations or other defect Solder the capacitor on the test jig glass epoxy board shown Termination should occur in Fig 3 using an eutectic solder Then apply 10N force in parallel with the tes...

Page 3: ...sure Capacitance Within 5 or 0 5pF Change Whichever is larger Q 30pF and over Q 350 10pF and over 30pF and below Q 275 5C 2 C Nominal Capacitance pF I R More than 1 000M 17 Humidity Load The measured...

Page 4: ...1 6mm Copper foil thickness 0 035mm Copper foil thickness 0 035mm Gray colored part of Fig 1 Solder resist Coat with heat resistant resin for solde Fig 1 in mm Fig 3 in mm Fig 2 in mm SPECIFICATIONS A...

Page 5: ...e K GQM18 4000 10000 GQM2 4000 10000 GQM2 1000 4000 1 2 Dimensions of Tape 1 GQM18 21 in mm Code GQM18 GQM21 A 1 05 0 1 1 55 0 15 B 1 85 0 1 2 3 0 15 2 GQM22 Code GQM22 A 2 8 B 3 5 Nominal Value PACKA...

Page 6: ...Hole As specified in 1 2 Hole for Chip As specified in 1 2 Base Tape As specified in 1 2 Bottom Tape Thickness 0 05 Only a bottom tape existence 180 0 3 0 330 2 0 50 min 13 0 5 2 0 0 5 Chip in mm Fig...

Page 7: ...om tape 1 9 There are no fuzz in the cavity 1 10 Break down force of top tape 5N min Break down force of bottom tape 5N min Only a bottom tape existence 1 11 Reel is made by resin and appeaser and dim...

Page 8: ...ight dust rapid temperature changes corrosive gas atmosphere or high temperature and humidity conditions during storage may affect the solderability and the packaging performance Please use product wi...

Page 9: ...ntended environment and operating conditions Typical temperature characteristics Char R6 X5R Typical temperature characteristics Char R7 X7R Typical temperature characteristics Char F5 Y5V 2 Measureme...

Page 10: ...Pulse voltage E Maximum possible applied voltage 1 2 Influence of overvoltage Overvoltage that is applied to the capacitor may result in an electrical short circuit caused by the breakdown of the inte...

Page 11: ...perature characteristics And check capacitors using your actual appliances at the intended environment and operating conditions 2 The capacitance values of high dielectric constant type capacitors cha...

Page 12: ...inted circuit board should not be allowed to hit the capacitor in order to avoid a crack or other damage to the capacitor Soldering and Mounting 1 Mounting Position 1 Confirm the best mounting positio...

Page 13: ...ssive forces are not applied to the capacitors 1 1 In mounting the capacitors on the printed circuit board any bending force against them shall be kept to a minimum to prevent them from any bending da...

Page 14: ...Time Recommended Conditions Pb Sn Solder Lead Free Solder Infrared Reflow Vapor Reflow Peak Temperature 230 250 230 240 240 260 Atmosphere Air Air Air or N2 Pb Sn Solder Sn 37Pb Lead Free Solder Sn 3...

Page 15: ...nd Time be sure to maintain the temperature difference T between the component and solvent within the range shown in the table 2 4 Do not apply flow soldering to GQM22 Series Table 2 GQM18 21 31 T 150...

Page 16: ...Solder Sn 37Pb Lead Free Solder Sn 3 0Ag 0 5Cu 4 Optimum Solder amount when re working with a Soldering lron 4 1 In case of sizes smaller than 0603 GQM18 the top of the solder fillet should be lower...

Page 17: ...rmance of a capacitor after mounting on the printed circuit board 1 1 Avoid bending printed circuit board by the pressure of a test pin etc The thrusting force of the test probe can flex the PCB resul...

Page 18: ...ig and from the front side of board as below the capacitor may form a crack caused by the tensile stress applied to capacitor Outline of jig 2 Example of a suitable machine An outline of a printed cir...

Page 19: ...thers 2 1 In an Emergency 1 If the equipment should generate smoke fire or smell immediately turn off or unplug the equipment If the equipment is not turned off or unplugged the hazards may be worsene...

Page 20: ...capacitors 1 1 The capacitor when used in the above unsuitable operating environments may deteriorate due to the corrosion of the terminations and the penetration of moisture into the capacitor 1 2 Th...

Page 21: ...sibility of chip crack caused by PCB expansion contraction with heat Because stress for chip is different depend on PCB material and structure Especially metal PCB such as alumina has a greater risk o...

Page 22: ...m the suitable land dimension by evaluating of the actual SET PCB Table 1 Flow Soldering Method Dimensions Part Number in mm Table 2 Reflow Soldering Method Dimensions Part Number in mm Notice Chip L...

Page 23: ...absorption Control curing temperature and time in order to prevent insufficient hardening 4 Flux Application 1 An excessive amount of flux generates a large quantity of flux gas which can cause a dete...

Page 24: ...ed as an under coating to buffer against the stress 2 Select a resin that is less hygroscopic Using hygroscopic resins under high humidity conditions may cause the deterioration of the insulation resi...

Page 25: ...cation 3 We consider it not appropriate to include any terms and conditions with regard to the business transaction in the product specifications drawings or other technical documents Therefore if you...

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