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Notice

6.Washing

1. Please evaluate a capacitor by actual cleaning equipment and condition surely for confirming the quality
    and select the applicable solvent.

2. Unsuitable cleaning solvent may leave residual flux, other foreign substances, causing deterioration of
    electrical characteristics and the reliability of the capacitors.

3. Select the proper cleaning conditions.
 3-1. Improper cleaning conditions (excessive or insufficient) may result in the deterioration of the
        performance of the capacitors.

7.Coating

1. A crack may be caused in the capacitor due to the stress of the thermal contraction of the resin during
 

 

curing process.

    The stress is affected by the amount of resin and curing contraction.
    Select a resin with small curing contraction.
    The difference in the thermal expansion coefficient between a coating resin or a molding resin and
    capacitor may cause the destruction and deterioration of the capacitor such as a crack or peeling, 
    and lead to the deterioration of insulation resistance or dielectric breakdown.
    Select a resin for which the thermal expansion coefficient is as close to that of capacitor as possible.
    A silicone resin can be used as an under-coating to buffer against the stress.

2. Select a resin that is less hygroscopic.
    Using hygroscopic resins under high humidity conditions may cause the deterioration of the
    insulation resistance of a capacitor.
    An epoxy resin can be used as a less hygroscopic resin.

 Others

1.Transportation

1. The performance of a capacitor may be affected by the conditions during transportation.

 1-1. The capacitors shall be protected against excessive temperature, humidity and mechanical force
        during transportation.
   (1) Climatic condition 
      

 low air temperature

:-

40

      

 change of temperature air/air

:-

25

/

25

      

 low air pressure

30 kPa

      

 change of air pressure

6 kPa/min

   (2) Mechanical condition 
        Transportation shall be done in such a way that the boxes are not deformed and forces are not
        directly passed on to the inner packaging.

 1-2. Do not apply excessive vibration, shock, and pressure to the capacitor.
   (1) When excessive mechanical shock or pressure is applied to a capacitor, chipping or cracking may
        occur in the ceramic body of the capacitor.
   (2) When a sharp edge of an air driver, a soldering iron, tweezers, a chassis, etc. impacts strongly 
        on the surface of capacitor, the capacitor may crack and short-circuit.

 1-3. Do not use a capacitor to which excessive shock was applied by dropping etc.
        The capacitor dropped accidentally during processing may be damaged.

JEMCNC-0012L

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Summary of Contents for GQM22M5C2H1R8BB01L

Page 1: ...30 ppm C 25 to 125 C 25 C 3 Temperature Characteristics Public STD Code C0G EIA Specifications and Test Methods Operationg Temp Range Temp coeff or Cap Change 5 Nominal Capacitance 6 Capacitance Toler...

Page 2: ...f the terminations or other defect Solder the capacitor on the test jig glass epoxy board shown Termination should occur in Fig 3 using an eutectic solder Then apply 10N force in parallel with the tes...

Page 3: ...sure Capacitance Within 5 or 0 5pF Change Whichever is larger Q 30pF and over Q 350 10pF and over 30pF and below Q 275 5C 2 C Nominal Capacitance pF I R More than 1 000M 17 Humidity Load The measured...

Page 4: ...1 6mm Copper foil thickness 0 035mm Copper foil thickness 0 035mm Gray colored part of Fig 1 Solder resist Coat with heat resistant resin for solde Fig 1 in mm Fig 3 in mm Fig 2 in mm SPECIFICATIONS A...

Page 5: ...e K GQM18 4000 10000 GQM2 4000 10000 GQM2 1000 4000 1 2 Dimensions of Tape 1 GQM18 21 in mm Code GQM18 GQM21 A 1 05 0 1 1 55 0 15 B 1 85 0 1 2 3 0 15 2 GQM22 Code GQM22 A 2 8 B 3 5 Nominal Value PACKA...

Page 6: ...Hole As specified in 1 2 Hole for Chip As specified in 1 2 Base Tape As specified in 1 2 Bottom Tape Thickness 0 05 Only a bottom tape existence 180 0 3 0 330 2 0 50 min 13 0 5 2 0 0 5 Chip in mm Fig...

Page 7: ...om tape 1 9 There are no fuzz in the cavity 1 10 Break down force of top tape 5N min Break down force of bottom tape 5N min Only a bottom tape existence 1 11 Reel is made by resin and appeaser and dim...

Page 8: ...ight dust rapid temperature changes corrosive gas atmosphere or high temperature and humidity conditions during storage may affect the solderability and the packaging performance Please use product wi...

Page 9: ...ntended environment and operating conditions Typical temperature characteristics Char R6 X5R Typical temperature characteristics Char R7 X7R Typical temperature characteristics Char F5 Y5V 2 Measureme...

Page 10: ...Pulse voltage E Maximum possible applied voltage 1 2 Influence of overvoltage Overvoltage that is applied to the capacitor may result in an electrical short circuit caused by the breakdown of the inte...

Page 11: ...perature characteristics And check capacitors using your actual appliances at the intended environment and operating conditions 2 The capacitance values of high dielectric constant type capacitors cha...

Page 12: ...inted circuit board should not be allowed to hit the capacitor in order to avoid a crack or other damage to the capacitor Soldering and Mounting 1 Mounting Position 1 Confirm the best mounting positio...

Page 13: ...ssive forces are not applied to the capacitors 1 1 In mounting the capacitors on the printed circuit board any bending force against them shall be kept to a minimum to prevent them from any bending da...

Page 14: ...Time Recommended Conditions Pb Sn Solder Lead Free Solder Infrared Reflow Vapor Reflow Peak Temperature 230 250 230 240 240 260 Atmosphere Air Air Air or N2 Pb Sn Solder Sn 37Pb Lead Free Solder Sn 3...

Page 15: ...nd Time be sure to maintain the temperature difference T between the component and solvent within the range shown in the table 2 4 Do not apply flow soldering to GQM22 Series Table 2 GQM18 21 31 T 150...

Page 16: ...Solder Sn 37Pb Lead Free Solder Sn 3 0Ag 0 5Cu 4 Optimum Solder amount when re working with a Soldering lron 4 1 In case of sizes smaller than 0603 GQM18 the top of the solder fillet should be lower...

Page 17: ...rmance of a capacitor after mounting on the printed circuit board 1 1 Avoid bending printed circuit board by the pressure of a test pin etc The thrusting force of the test probe can flex the PCB resul...

Page 18: ...ig and from the front side of board as below the capacitor may form a crack caused by the tensile stress applied to capacitor Outline of jig 2 Example of a suitable machine An outline of a printed cir...

Page 19: ...thers 2 1 In an Emergency 1 If the equipment should generate smoke fire or smell immediately turn off or unplug the equipment If the equipment is not turned off or unplugged the hazards may be worsene...

Page 20: ...capacitors 1 1 The capacitor when used in the above unsuitable operating environments may deteriorate due to the corrosion of the terminations and the penetration of moisture into the capacitor 1 2 Th...

Page 21: ...sibility of chip crack caused by PCB expansion contraction with heat Because stress for chip is different depend on PCB material and structure Especially metal PCB such as alumina has a greater risk o...

Page 22: ...m the suitable land dimension by evaluating of the actual SET PCB Table 1 Flow Soldering Method Dimensions Part Number in mm Table 2 Reflow Soldering Method Dimensions Part Number in mm Notice Chip L...

Page 23: ...absorption Control curing temperature and time in order to prevent insufficient hardening 4 Flux Application 1 An excessive amount of flux generates a large quantity of flux gas which can cause a dete...

Page 24: ...ed as an under coating to buffer against the stress 2 Select a resin that is less hygroscopic Using hygroscopic resins under high humidity conditions may cause the deterioration of the insulation resi...

Page 25: ...cation 3 We consider it not appropriate to include any terms and conditions with regard to the business transaction in the product specifications drawings or other technical documents Therefore if you...

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