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No

Item

Test  Method

1 Operating

2C,5C : -55

 to 125

Temperature Range

2 Rated Voltage

See the previous pages.

 The rated voltage is defined as the maximum voltage which may  be 

 applied continuously to the capacitor.

 When AC voltage is superimposed on DC voltage, V

P-P

 or  V

O-P

,

 whichever is larger, should be maintained within the rated 

  voltage range.

3 Appearance

No defects or abnormalities.

Visual inspection.

4 Dimension

Within the specified dimensions.

Using calipers. 

5 Dielectric Strength

No defects or abnormalities.

No failure should be observed when 250% of the rated

voltage  is applied between the terminations for 1 to 5

seconds, provided the charge/discharge current is less

than 50mA.

6 Insulation 

More than 10,000M

Ω

The insulation resistance should be measured with a DC

      Resistance

voltage not exceeding the rated voltage at 20

/25

and 75%RH max. and within 2 minutes of charging.

7 Capacitance

Within the specified tolerance. 

The capacitance/Q should be measured at 20

/25

at the frequency and voltage shown in the table.

8 Q

30pFmin. : Q

1400

30pFmax.: Q

800+20C

C:NominalCapacitance (pF) 

9

Capacitance

Capacitance Within the specified tolerance.(Table A-1)

The temperature coefficient is determind using the

Temperature

Change

capacitance measured in step 3 as a reference.

Characteristics

When cycling the temperature sequentially from step 1 

through 5 the capacitance should be within the specified

 

tolerance for the temperature coefficient and capacitance 

Temperature Within the specified tolerance.(Table A-1)

change as Table A-1.

Coefficent

The capacitance drift is caluculated by dividing the 

differences betweeen the maximum and minimum measured

values in the step 1,3 and 5 by the cap. value in step 3.

Capacitance Within 

±

0.2% or 

±

0.05pF

Drift

(Whichever is larger.)

10 Adhesive Strength of 

No removal of the terminations or other defect should occur. 

Solder the capacitor on the test jig (glass epoxy

Termination

board)shown in Fig.3 using an eutectic solder. Then apply

10N* force in parallel with the test jig for 10+/-1sec.

The soldering should be done either with an iron or using the

reflow method and should be conducted with care so that the

soldering is uniform and free of defects such as heat shock.

*5N

GQM18)

11 Vibration 

Appearance No defects or abnormalities.

Solder the capacitor on the test jig (glass epoxy board) in the

Resistance

same manner and under the same conditions as (10). 

Capacitance Within the specified tolerance.

The capacitor should be subjected to a simple harmonic

motion having a total amplitude of 1.5mm, the frequency

Q

30pFmin. : Q

1400

being varied uniformly between the approximate limits of 10

30pFmax.: Q

800+20C

and 55Hz. The frequency range, from 10 to 55Hz and return

to 10Hz, should be traversed in approximately 1 minute. This

C:NominalCapacitance (pF)

motion should be applied for a period of 2 hours in each 3

 

 

mutually perpendicular directions(total of 6 hours).

12 Deflection

Appearance No marking defects.

Solder the capacitor on the test jig (glass epoxy board)

shown in Fig.1 using an eutectic solder. Then apply a force

Capacitance Within 

±

5

 or 

±

0.5pF

in the direction shown in Fig 2. The soldering

Change

(Whichever is larger)

should be done by the reflow method and should be

conducted with care so that the soldering is uniform and free

of defects such as heat shock.

13 Solderability

75% of the terminations is to be soldered evenly 

Immerse the capacitor in a solution of ethanol (JIS-K-8101)

        of Termination

and continuously.

and rosin (JIS-K-5902) (25% rosin in weight propotion) .

Preheat at 80 to 120

  for 10 to 30 seconds.

After preheating, immerse in an eutectic solder solution for 

2+/-0.5 seconds at 230+/-5

 or Sn-3.0Ag-0.5Cu solder

solution for 2+/-0.5 seconds at 245+/-5

SPECIFICATIONS AND TEST METHODS

Specification

 

 

 

Char. 

Item 

Δ

(1000pF and below) 

Frequency 

1

0.1MHz 

Voltage 

0.5 to 5Vrms 

 

  

Step 

Temperature(

C) 

20

2 / 25

-55

20

2 / 25

125

20

2 / 25

JEMCNS-0022C

2

Summary of Contents for GQM2195C2E130GB12 Series

Page 1: ...ance Tolerance 250 Vdc 13 pF Temp Range Ref Temp 8 Packaging 1 2 W 1 25 0 15 e 2 55 to 125 C 0 30 ppm C 25 to 125 C 25 C 3 Temperature Characteristics Public STD Code C0G EIA Specifications and Test Methods Operationg Temp Range Temp coeff or Cap Change D f180mm Reel PAPER W8P4 4000 pcs Reel 0 7 min 2 T 0 85 0 15 This product specification is applied to RF High Frequency Chip Monolithic Ceramic Ca...

Page 2: ...ur Solder the capacitor on the test jig glass epoxy Termination board shown in Fig 3 using an eutectic solder Then apply 10N force in parallel with the test jig for 10 1sec The soldering should be done either with an iron or using the reflow method and should be conducted with care so that the soldering is uniform and free of defects such as heat shock 5N GQM18 11 Vibration Appearance No defects o...

Page 3: ...5 5C 2 C Nominal Capacitance pF I R More than 1 000MΩ 17 Humidity Load The measured and observed characteristics shall satisfy Apply the rated voltage at 40 2 and 90 to 95 humidity the specifications in the following table for 500 12 hours Appearance No defects or abnormalities Remove and let sit for 24 2 hours at room temprature then muasure The charge discharge current is less than 50mA Capacita...

Page 4: ...of Fig 1 Solder resist Coat with heat resistant resin for solder Fig 1 in mm Fig 3 in mm Fig 2 in mm SPECIFICATIONS AND TEST METHODS 2 4 0 0 1 8 0 0 3 3 5 0 05 0 05以下 1 φ1 5 0 1 0 A t 1 2 2 0 0 05 1 75 0 1 B 100 40 a c b Land f4 5 c a c b ランド f4 5 c Glass epoxy board Solder resist Baked electrode or copper foil b R230 20 50 Flexure 1 Capacitance meter Pressurizing speed 1 0mm sec Support Pressuri...

Page 5: ... GQM18 4000 10000 GQM2 4000 10000 GQM2 1000 4000 1 2 Dimensions of Tape 1 GQM18 21 in mm Code GQM18 GQM21 A 1 05 0 1 1 55 0 15 B 1 85 0 1 2 3 0 15 2 GQM22 Code GQM22 A 2 8 B 3 5 Nominal Value PACKAGING GQM Type Type 4 0 0 1 4 0 0 1 2 0 0 05 φ1 5 0 1 0 1 75 0 1 8 0 0 3 3 5 0 05 1 1 max A B 8 0 0 3 4 0 0 1 3 5 0 05 1 75 0 1 A B 2 5 max 2 0 0 1 φ1 5 0 1 0 4 0 0 1 0 25 0 1 JEMCNP 01900 5 ...

Page 6: ...ng Hole As specified in 1 2 Hole for Chip As specified in 1 2 Base Tape As specified in 1 2 Bottom Tape Thickness 0 05 Only a bottom tape existence φ180 0 3 0 φ330 2 0 φ50 min φ13 0 5 2 0 0 5 Chip in mm Fig 1 Package Chips Fig 2 Dimensions of Reel Fig 3 Taping Diagram JEMCNP 01900 6 ...

Page 7: ...9 There are no fuzz in the cavity 1 10 Break down force of top tape 5N min Break down force of bottom tape 5N min Only a bottom tape existence 1 11 Reel is made by resin and appeaser and dimension is shown in Fig 1 There are possibly to change the material and dimension due to some impairment 1 12 Peeling off force 0 1N to 0 6N in the direction as shown below 1 13 Label that show the customer part...

Page 8: ...light dust rapid temperature changes corrosive gas atmosphere or high temperature and humidity conditions during storage may affect the solderability and the packaging performance Please use product within six months of receipt 2 Please confirm solderability before using after six months Store the capacitors without opening the original bag Even if the storage period is short do not exceed the spe...

Page 9: ...intended environment and operating conditions Typical temperature characteristics Char R6 X5R Typical temperature characteristics Char R7 X7R Typical temperature characteristics Char F5 Y5V 2 Measurement of Capacitance 1 Measure capacitance with the voltage and the frequency specified in the product specifications 1 1 The output voltage of the measuring equipment may decrease when capacitance is h...

Page 10: ... Pulse voltage E Maximum possible applied voltage 1 2 Influence of overvoltage Overvoltage that is applied to the capacitor may result in an electrical short circuit caused by the breakdown of the internal dielectric layers The time duration until breakdown depends on the applied voltage and the ambient temperature 4 Applied Voltage and Self heating Temperature 1 When the capacitor is used in a hi...

Page 11: ...mperature characteristics And check capacitors using your actual appliances at the intended environment and operating conditions 2 The capacitance values of high dielectric constant type capacitors change depending on the AC voltage applied Please consider the AC voltage characteristics when selecting a capacitor to be used in a AC circuit AC voltage characteristics 6 Capacitance Aging 1 The high ...

Page 12: ...rinted circuit board should not be allowed to hit the capacitor in order to avoid a crack or other damage to the capacitor Soldering and Mounting 1 Mounting Position 1 Confirm the best mounting position and direction that minimizes the stress imposed on the capacitor during flexing or bending the printed circuit board 1 1 Choose a mounting position that minimizes the stress imposed on the chip dur...

Page 13: ...essive forces are not applied to the capacitors 1 1 In mounting the capacitors on the printed circuit board any bending force against them shall be kept to a minimum to prevent them from any bending damage or cracking Please take into account the following precautions and recommendations for use in your process 1 Adjust the lowest position of the pickup nozzle so as not to bend the printed circuit...

Page 14: ...and Time Recommended Conditions Pb Sn Solder Lead Free Solder Infrared Reflow Vapor Reflow Peak Temperature 230 250 230 240 240 260 Atmosphere Air Air Air or N2 Pb Sn Solder Sn 37Pb Lead Free Solder Sn 3 0Ag 0 5Cu In case of repeated soldering the accumulated soldering time must be within the range shown above 4 Optimum Solder Amount for Reflow Soldering 4 1 Overly thick application of solder past...

Page 15: ...d Time be sure to maintain the temperature difference ΔT between the component and solvent within the range shown in the table 2 4 Do not apply flow soldering to GQM22 Series Table 2 GQM18 21 31 ΔT 150 In case of repeated soldering the accumulated soldering time must be within the range shown above Recommended Conditions Pb Sn Solder Lead Free Solder 90 110 100 120 240 250 250 260 Air N2 Pb Sn Sol...

Page 16: ...Solder Sn 37Pb Lead Free Solder Sn 3 0Ag 0 5Cu 4 Optimum Solder amount when re working with a Soldering lron 4 1 In case of sizes smaller than 0603 GQM18 the top of the solder fillet should be lower than 2 3 s of the thickness of the component or 0 5mm whichever is smaller In case of 0805 and larger sizes GQM21 22 the top of the solder fillet should be lower than 2 3 s of the thickness in section ...

Page 17: ...ormance of a capacitor after mounting on the printed circuit board 1 1 Avoid bending printed circuit board by the pressure of a test pin etc The thrusting force of the test probe can flex the PCB resulting in cracked chips or open solder joints Provide support pins on the back side of the PCB to prevent warping or flexing 1 2 Avoid vibration of the board by shock when a test pin contacts a printed...

Page 18: ...jig and from the front side of board as below the capacitor may form a crack caused by the tensile stress applied to capacitor Outline of jig 2 Example of a suitable machine An outline of a printed circuit board cropping machine is shown as follows Along the lines with the V grooves on printed circuit board the top and bottom blades are aligned to one another when cropping the board The misalignme...

Page 19: ...Others 2 1 In an Emergency 1 If the equipment should generate smoke fire or smell immediately turn off or unplug the equipment If the equipment is not turned off or unplugged the hazards may be worsened by supplying continuous power 2 In this type of situation do not allow face and hands to come in contact with the capacitor or burns may be caused by the capacitors high temperature 2 2 Disposal of...

Page 20: ... capacitors 1 1 The capacitor when used in the above unsuitable operating environments may deteriorate due to the corrosion of the terminations and the penetration of moisture into the capacitor 1 2 The same phenomenon as the above may occur when the electrodes or terminals of the capacitor are subject to moisture condensation 1 3 The deterioration of characteristics and insulation resistance due ...

Page 21: ...ssibility of chip crack caused by PCB expansion contraction with heat Because stress for chip is different depend on PCB material and structure Especially metal PCB such as alumina has a greater risk of chip crack because of large difference of thermal expansion coefficient In case of chip below 0402 size there is also the same possibility of crack with a single layered glass epoxy board Pattern F...

Page 22: ...rm the suitable land dimension by evaluating of the actual SET PCB Table 1 Flow Soldering Method Dimensions Part Number in mm Table 2 Reflow Soldering Method Dimensions Part Number in mm Notice Chip L W a b c 0 8 1 1 GQM18 GQM21 1 6 0 8 0 6 1 0 1 9 2 3 Chip L W a b c 2 0 1 25 1 0 1 2 0 6 0 7 0 8 1 1 1 6 0 8 0 8 0 9 0 6 0 8 1 0 1 2 GQM18 GQM21 0 6 0 8 GQM22 2 0 1 25 2 8 2 8 0 9 1 0 2 2 2 5 0 8 1 0 ...

Page 23: ... absorption Control curing temperature and time in order to prevent insufficient hardening 4 Flux Application 1 An excessive amount of flux generates a large quantity of flux gas which can cause a deterioration of Solderability So apply flux thinly and evenly throughout A foaming system is generally used for flow soldering 2 Flux containing too a high percentage of halide may cause corrosion of th...

Page 24: ...sed as an under coating to buffer against the stress 2 Select a resin that is less hygroscopic Using hygroscopic resins under high humidity conditions may cause the deterioration of the insulation resistance of a capacitor An epoxy resin can be used as a less hygroscopic resin Others 1 Transportation 1 The performance of a capacitor may be affected by the conditions during transportation 1 1 The c...

Page 25: ...ication 3 We consider it not appropriate to include any terms and conditions with regard to the business transaction in the product specifications drawings or other technical documents Therefore if your technical documents as above include such terms and conditions such as warranty clause product liability clause or intellectual property infringement liability clause they will be deemed to be inva...

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