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SPECIFICATIONS AND PIN INFORMATION

MultiConnect

®

mDot

TM

MTDOT Developer Guide for Japan

21

Electrical and Timing Characteristics

Note:

All measurements taken at VDD = 3.3 V and 25 degrees Celsius ambient temperature unless
otherwise specified.

Refer to the ST Micro STM32F411RE datasheet for more detailed processor IO characteristics.

The STM32F411RE and other onboard ICs are powered by an internal 3.0V voltage regulator.

Signal

Description

Conditions

Min

Typical

Max

Units

VCC

Operating Voltage

3.3

--

5

V

Vin Low

IO input low level

--

--

0.9

V

Vin High

IO input high level

2.1

--

--

V

Vout Low

IO output low level

Pin current = 8mA

--

--

0.4

V

Vout High

IO output high level 3.3V < VDD < 5V

2.4

--

--

V

Vout Low

IO output low level

Pin current = 20mA

--

--

1.3

V

Vout High

IO output high level 3.3V < VDD < 5V

1.7

--

--

V

ICC

Idle mode (no TX, no
RX), processor active

--

32

--

mA

TX, TXP=2

--

34

--

mA

TX, TXP=11

--

73

--

mA

TX, TXP=20

--

130

--

mA

Maximum supply
current. Transmitting
at TXP=20, all
peripherals active, no
load on IO pins. VDD
= 3.3V. 25 degC
ambient
temperature.

--

--

250

mA

Sleep mode

--

40

--

uA

Deep sleep mode

--

40

--

uA

RX

--

43

--

mA

T

NRESET

NRESET minimum
pulse duration

--

1

--

--

ms

V

NRESET

Low

NRESET input low
level

--

--

--

0.9

V

V

NRESET

High

NRESET input high
level

Note: The mDot has
an internal pull-up
resistor.

2.1

--

--

V

Summary of Contents for MultiConnect mDot MTDOT Series

Page 1: ...MultiConnect mDotTM MTDOT Developer Guide for Japan...

Page 2: ...DOES NOT WARRANT THAT THE TRANSMISSION OF DATA BY A PRODUCT OVER A CELLULAR COMMUNICATIONS NETWORK WILL BE UNINTERRUPTED TIMELY SECURE OR ERROR FREE NOR DOES MULTITECH WARRANT ANY CONNECTION OR ACCES...

Page 3: ...nfiguration Persistence 9 Differential and Compressed Upgrade Files 10 Product Build Options 10 Chapter 2 Getting Started 11 Chapter 3 FOTA FUOTA Overview 12 FOTA Stages 12 Potential Problems 14 Troub...

Page 4: ...Potential interference 30 Precautions for pacemaker wearers 31 Device Maintenance 31 User Responsibility 31 Chapter 8 Environmental Notices 32 Restriction of the Use of Hazardous Substances RoHS 33 C...

Page 5: ...PC Board Layout Guideline 59 Electromagnetic Interference 59 Electrostatic Discharge Control 60 USB Design 60 Chapter 15 Appendix A Release Note Archive 61 What s New in Firmware Version 3 3 61 LoRaW...

Page 6: ...or Changed in Version 2 0 64 Maintenance Release 1 0 8 1 65 What s New in Firmware Version 1 0 65 About Adaptive Data Rate 65 Peer to Peer Communication 65 EU 868 Test Mode 66 Sleep Mode Enhancements...

Page 7: ...The new release includes the following changes Configuration Persistence Sleep FOTA Enhancements New and updated AT Commands Configuration Persistence To safeguard your configuration the device offers...

Page 8: ...ST MDOT Developer Kit including design considerations schematics and installation and operation information Chapters 9 13 This manual is available at www multitech com support Related Documentation mD...

Page 9: ...om docs mbed os mbed online compiler documentation https os mbed com docs mbed os latest quick start online with the online compiler html mbed cli documentation https os mbed com docs mbed os latest q...

Page 10: ...iver an update Smaller FOTA sessions increase end device battery life Creating Differential and Compressed Files To package application firmware binaries for Dot devices with compression or deltas use...

Page 11: ...he Developer Board 2 Open communications software such as HyperTerminal or TeraTerm 3 Set the following Baud rate 115 200 Data bits 8 Parity N Stop bits 1 Flow control Off Two serial interfaces are av...

Page 12: ...RC message id sent in Class A This could happen any time after the last fragment is sent to after the last parity is sent For details on the FOTA AT Commands go to mDot AT Command Reference Guide S000...

Page 13: ...cause fragments to overlap and excessive fragment loss The number of fragments required to send a file depends on the Data Rate The device clears the file system to ensure enough free space to save u...

Page 14: ...on will likely fail The FOTA session sends down packets every 1 5 seconds assuming no duty cycle and parity packets every 3 seconds by default For best results Multitech recommends users suspend all n...

Page 15: ...ting Troubleshooting Verify that there is not a current FOTA session If there is no current FOTA session and a FOTA session will not start reboot the Conduit If the Conduit does not receive at least o...

Page 16: ...Make sure to change the devices back to their appropriate class Make sure the FOTA daemon is running by etc init d fotad restart To end a Multicast session that is in progress use ps A grep mcm Find t...

Page 17: ...MECHANICAL DRAWINGS WITH PINOUTS MultiConnect mDotTM MTDOT Developer Guide for Japan 17 Chapter 4 Mechanical Drawings with Pinouts MTDOT xxx X1P SMA...

Page 18: ...TS CPU Performance CPU STM32 Max Clock 96 MHz Flash Memory 512 KB 400 KB available RAM 128 KB Radio Frequency ISM Bands EU 863 MHz 868 MHz NAM 902 MHz 928 MHz AU 915 MHz 928 MHz Physical Description W...

Page 19: ...ware version 2 0 16 SPI flash access is prevented if the onboard LDO regulator output drops below 3 V This code change protects the SPI file system from corruption that could occur from power drop or...

Page 20: ...attery life depends on many variables including transmit power data rate sleep usage and duty cycle The following figure represents the current consumption in one possible application Use the current...

Page 21: ...input low level 0 9 V Vin High IO input high level 2 1 V Vout Low IO output low level Pin current 8mA 0 4 V Vout High IO output high level 3 3V VDD 5V 2 4 V Vout Low IO output low level Pin current 2...

Page 22: ...PECIFICATIONS AND PIN INFORMATION 22 MultiConnect mDotTM MTDOT Developer Guide for Japan Pin Information Note Using the mbed platform with the Cortex M4 processor expands your pin functionality option...

Page 23: ...power modes on rising edge 13 PC13 ON_SLEEP Sleep On 14 No Connect Not routed on board 15 PC1 ASSOCIATE GPIO 16 PA1 GPIO4 GPIO 17 PA4 SPI1_CS 18 PA5 SPI1_SCK 19 PB0 GPIO1 20 PB1 GPIO0 24 VDDA 3V 25ma...

Page 24: ...serial communications with the device without deselecting the device PC_8 FLASH_WP Flash write protect Pull Up Down mDot Pin Pin Name SW Name PU PD 5 NRST NRESET 10K PU PB12 LORA_NSS 100K PU PC6 SPI3...

Page 25: ...Real time clock PC15 Real time clock PH0 OSC_IN High speed system clock PH1 OSC_OUT High speed system clock Route Pads For U FL models use the U FL connector or route pads as follows These are also a...

Page 26: ...most flexibility For more information about processor capabilities see the STM32F411 RET datasheet Note To program the mDot you need an mDot model with programming header model MTDOT xx X1P SMA Serial...

Page 27: ...ide for Japan 27 Resetting the mDot To reset the mDot 1 Drive the RESET signal low for at least TNRESET 2 Select either Allow RESET to float The internal pull up resistor pulls it up Drive the RESET l...

Page 28: ...s Currently FCC approval includes Pulse Electronics SMA antenna only If using U FL or trace antennas note the following For a simple trace to RF antennas Routing must follow standard RF design rules a...

Page 29: ...ANTENNAS MultiConnect mDotTM MTDOT Developer Guide for Japan 29 Category Description Impedance 50 Ohms VSWR 2 0 Gain 3 0 dBi Radiation Omni Polarization Vertical...

Page 30: ...restrictions on the use of radio equipment in fuel depots chemical plants or where blasting operations are in process Follow restrictions for any environment where you operate the device Do not place...

Page 31: ...device and or other equipment or harm users Do not apply excessive pressure or place unnecessary weight on the device This could result in damage to the device or harm to users Do not use this device...

Page 32: ...ENVIRONMENTAL NOTICES 32 MultiConnect mDotTM MTDOT Developer Guide for Japan Chapter 8 Environmental Notices...

Page 33: ...not contain the following banned chemicals1 Lead Pb 1000 PPM Mercury Hg 100 PPM Cadmium Cd 100 PPM Hexavalent Chromium Cr 6 1000 PPM Polybrominated Biphenyl PBB 1000 PPM Polybrominated Diphenyl Ether...

Page 34: ...our products and applications Easily plug in your communications device and use the developer kit for testing programming and evaluation Note Developer information in this section applies to using eit...

Page 35: ...BOARD COMPONENTS MultiConnect mDotTM MTDOT Developer Guide for Japan 35 Chapter 10 Board Components Developer Board...

Page 36: ...BOARD COMPONENTS 36 MultiConnect mDotTM MTDOT Developer Guide for Japan Note mDot developer boards may be white or dark blue...

Page 37: ...mbed serial and SocketModem Attaches to the ST Micro controller This provides access to two interfaces one used to program the mDot and the other for debug messages JP98 Serial Disconnect Header Pins...

Page 38: ...g USB cables to avoid detaching the connector from the board LED Indicators Label LED Location STAT LED1 Near JP198 COM LED2 Near JP198 D7 LED3 Across the mDot connectors D6 LED7 Directly across from...

Page 39: ...DOT Developer Guide for Japan 39 Chapter 11 Developer Board Installation Installing an mDot on the Developer Board To install an mDot on the Developer Board 1 Align the mDot with the developer board a...

Page 40: ...DEVELOPER BOARD INSTALLATION 40 MultiConnect mDotTM MTDOT Developer Guide for Japan...

Page 41: ...o Shield with an mDot install the mDot on the developer board before installing the Arduino shield To use an Arduino Shield with an mDot 1 Disable the developer card s serial port by removing jumper f...

Page 42: ...is preinstalled on the developer board Connecting an Antenna through the Developer Board Connectors Depending on the device model you can either connect antennas directly to the device or through the...

Page 43: ...t mDotTM MTDOT Developer Guide for Japan 43 Chapter 12 Developer Board Schematics About Schematics The following schematics are for the fully populated MTUDK2 developer board and contain components no...

Page 44: ...DEVELOPER BOARD SCHEMATICS 44 MultiConnect mDotTM MTDOT Developer Guide for Japan Block Diagram...

Page 45: ...DEVELOPER BOARD SCHEMATICS MultiConnect mDotTM MTDOT Developer Guide for Japan 45 Schematics...

Page 46: ...DEVELOPER BOARD SCHEMATICS 46 MultiConnect mDotTM MTDOT Developer Guide for Japan...

Page 47: ...DEVELOPER BOARD SCHEMATICS MultiConnect mDotTM MTDOT Developer Guide for Japan 47...

Page 48: ...DEVELOPER BOARD SCHEMATICS 48 MultiConnect mDotTM MTDOT Developer Guide for Japan...

Page 49: ...DEVELOPER BOARD SCHEMATICS MultiConnect mDotTM MTDOT Developer Guide for Japan 49...

Page 50: ...K V2 firmware through the mDot mbed page at https developer mbed org platforms MTS mDot F411 general technical references Firmware Updates Before starting your project development make sure you have t...

Page 51: ...MICRO DEVELOPER KIT MultiConnect mDotTM MTDOT Developer Guide for Japan 51 Micro DK Mechanical Drawings...

Page 52: ...ht that blinks when device powers up COM LED2 Communication green light that shows when device is communicating PWR LED3 Power blue lights when the board has power RSSI LED4 Received Signal Strength I...

Page 53: ...MICRO DEVELOPER KIT MultiConnect mDotTM MTDOT Developer Guide for Japan 53 Assembly Diagrams and Schematics Assembly Diagrams...

Page 54: ...MICRO DEVELOPER KIT 54 MultiConnect mDotTM MTDOT Developer Guide for Japan Schematics...

Page 55: ...MICRO DEVELOPER KIT MultiConnect mDotTM MTDOT Developer Guide for Japan 55...

Page 56: ...MICRO DEVELOPER KIT 56 MultiConnect mDotTM MTDOT Developer Guide for Japan...

Page 57: ...MICRO DEVELOPER KIT MultiConnect mDotTM MTDOT Developer Guide for Japan 57...

Page 58: ...MICRO DEVELOPER KIT 58 MultiConnect mDotTM MTDOT Developer Guide for Japan...

Page 59: ...Layout Guideline In a 4 layer design provide adequate ground plane covering the entire board In 4 layer designs power and ground are typically on the inner layers Ensure that all power and ground trac...

Page 60: ...ischarge Control for Protection of Electrical and Electronic Parts Assemblies and Equipment This document covers ESD Control Program Administrative Requirements ESD Training ESD Control Program Plan T...

Page 61: ...ent Join App Nonce is validated to increment with each Join Accept received Nonces reset when AppEUI JoinEUI is changed Added support for multicast sessions in various areas including Network Address...

Page 62: ...upport Russian channel plan support New and updated AT Commands LoRaWAN Version 1 0 3 Class B Support The LoRaWAN Class B option allows devices to open receive windows at fixed time intervals for serv...

Page 63: ...automatically goes into a stop sleep mode after an uplink transmit ends and in between two receive windows In the stop sleep mode RAM and register contents are retained but all peripheral clocks are...

Page 64: ...guration Join via OTA or ABP as normal AT DC C AT W AT SD Soon after being schedule to the network server the device receives packets If the network server requests an ACK the device automatically sen...

Page 65: ...data rate based on that sample The possible data rate for a number of packets is held until the packet threshold is met Once the threshold is met a LinkADRAns MAC command is sent to request that the...

Page 66: ...iance Test mode is administered at the application level so the mDot must be joined to the network via ABPA or OTAA prior to testing Test mode allows you to test the mDot without special commands from...

Page 67: ...ave Session SS AT Commands Added or Changed in Version 1 0 The following AT Commands were added or modified in this release Refer to the MultiConnect Dot AT Command Reference for details Command Funct...

Page 68: ...cs 21 deep sleep mode 66 device maintenance 31 documentation 8 E electromagnetic interference 59 electrostatic discharge 60 EMI 59 ESD 60 EU 868 test mode 66 EUI 9 F firmware upgrade over the air 12 f...

Page 69: ...ivity 18 related products 8 reset 27 RoHS 33 RSMA to U FL cable 42 S safety RF interference 30 safety standards 59 schematics 45 sleep mode 66 SMA to U FL 42 specifications 18 static 30 STmicro proces...

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