Motorola GP series, Detailed Service Manual

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2-2 MAINTENANCE
Isopropyl alcohol may be applied with a stiff, non-metallic, short-bristled brush to
dislodge embedded or caked materials located in hard-to-reach areas. The brush stroke
should direct the dislodged material out and away from the inside of the radio. Make sure
that controls or tunable components are not soaked with alcohol. Do not use high-
pressure air to hasten the drying process since this could cause the liquid to collect in
unwanted places. Upon completion of the cleaning process, use a soft, absorbent,
lintless cloth to dry the area. Do not brush or apply any isopropyl alcohol to the frame,
front cover, or back cover.
3.0 Safe Handling of CMOS and LDMOS
Complementary metal-oxide semiconductor (CMOS) devices are used in this family of radios.
CMOS characteristics make them susceptible to damage by electrostatic or high voltage charges.
Damage can be latent, resulting in failures occurring weeks or months later. Therefore, special
precautions must be taken to prevent device damage during disassembly, troubleshooting, and
repair.
Handling precautions are mandatory for CMOS circuits and are especially important in low humidity
conditions. DO NOT attempt to disassemble the radio without first referring to the CMOS CAUTION
paragraph in the Disassembly and Reassembly section of the manual.
4.0 General Repair Procedures and Techniques
NOTE Always use a fresh supply of alcohol and a clean container to prevent contamination by
dissolved material (from previous usage).
NOTE Environmentally Preferred Products (EPP) (refer to the marking on the printed circuit
boards) were developed and assembled using environmentally preferred components
and solder assembly techniques to comply with the European Union’s ROHS and WEEE
directives
(Waste Electrical and Electronic Equipment (WEEE) Directive 2002/96/EC
and Restriction of Hazardous Subtances (ROHS) Directive 2002/95/EC). To maintain
product compliance and reliability, use only the Motorola specified parts in this manual.
For the identification of lead (Pb) free assemblies, all EPP products will carry the EPP
Marking, shown below, on the printed circuit board (PCB). This marking provides infor-
mation to those performing assembly, servicing and recycling operation on this product,
adhering to the JEDEC standard #97. The EPP Marking takes the form of a label or
marking on the PCB