ii
Table of Contents
MSC8101 Features............................................................................................................................................. iii
Target Applications ............................................................................................................................................ iv
Product Documentation...................................................................................................................................... iv
Chapter 1
Signal/ Connection Descriptions
1.1
Signal Groupings.............................................................................................................................................. 1-1
1.2
Power Signals................................................................................................................................................... 1-4
1.3
Clock Signals ................................................................................................................................................... 1-5
1.4
Reset, Configuration, and EOnCE Event Signals ............................................................................................ 1-6
1.5
System Bus, HDI16, and Interrupt Signals ...................................................................................................... 1-8
1.6
Memory Controller Signals............................................................................................................................ 1-16
1.7
Communications Processor Module (CPM) Ports ......................................................................................... 1-18
1.8
JTAG Test Access Port Signals ...................................................................................................................... 1-45
1.9
Reserved Signals ............................................................................................................................................ 1-46
Chapter 2
Specifications
2.1
Introduction ...................................................................................................................................................... 2-1
2.2
Absolute Maximum Ratings ............................................................................................................................ 2-1
2.3
Recommended Operating Conditions .............................................................................................................. 2-2
2.4
Thermal Characteristics ................................................................................................................................... 2-2
2.5
DC Electrical Characteristics ........................................................................................................................... 2-3
2.6
Clock Configuration......................................................................................................................................... 2-4
2.7
AC Timings ...................................................................................................................................................... 2-7
Chapter 3
Packaging
3.1
Pin-Out and Package Information .................................................................................................................... 3-1
3.2
FC-PBGA Package Description ....................................................................................................................... 3-1
3.3
FC-PBGA Package Mechanical Drawing ...................................................................................................... 3-32
Chapter 4
Design Considerations
4.1
Thermal Design Considerations ....................................................................................................................... 4-1
4.2
Electrical Design Considerations ..................................................................................................................... 4-2
4.3
Power Considerations....................................................................................................................................... 4-2
4.4
Layout Practices ............................................................................................................................................... 4-4
Index
Ordering Information, Disclaimer, and Contact Information
.................................................................. Back Cover
Data Sheet Conventions
OVERBAR
Used to indicate a signal that is active when pulled low (For example, the RESET pin is active when
low.)
“asserted”
Means that a high true (active high) signal is high or that a low true (active low) signal is low
“deasserted”
Means that a high true (active high) signal is low or that a low true (active low) signal is high
Examples:
Signal/Symbol
Logic State
Signal State
Voltage
PIN
True
Asserted
V
IL
/V
OL
PIN
False
Deasserted
V
IH
/V
OH
PIN
True
Asserted
V
IH
/V
OH
PIN
False
Deasserted
V
IL
/V
OL
Note: Values for V
IL
, V
OL
, V
IH
, and V
OH
are defined by individual product specifications.
