Technical Description
miriac MPX-LX2160A User Manual
V1.4
35/73
© MicroSys Electronics GmbH 2020
4.10
Memory DRAM
There are twenty DDR4 memory chips directly soldered to the module. Depending
on which parts are assembled, there may be:
•
20x (16 Data + 4 ECC) 8Gbit (512Mbx16) = 16 GBytes of DRAM
•
20x (16 Data + 4 ECC) 16Gbit (1Gbx16) = 32 GBytes of DRAM
•
20x (16 Data+ 4 ECC) 32Gbit (2Gbx16) = 64 GBytes of DRAM
Optionally, two DDR4-SODIMM modules (with ECC support) can be installed for
expanding the memory by, up to, 64 GBytes. Meaning 128 GBytes DDR4 is
maximum possible configuration.
Soldered x32
D0..D31
Soldered x32
D32..D64
ECC x8
SO-DIMM
DRAM
controller 1
Slot A
2..16 GByte
2..16 GByte
Opt.
Slot B
Up to
32GByte
DRAM
controller 1
Slot A
2..16 GByte
2..16 GByte
Opt.
Slot B
Up to
32GByte
Table 4-9 DRAM assembly options
4.11
Memory eMMC
The MPX-LX2160A module is optionally equipped with 32GB of eMMC Flash on
the SDHC2 port of the LX2160A. Different sizes may be available on request/order.
The following table shows the connections and signal levels for the eMMC Flash:
CPU
eMMC Flash
THGBMHG8C4LBAU7
Ball
Signal
Pin
Signal
I/O
Range
A23
SDHC2_DAT0
↔
A3
SDHC2_DAT0
1,8V
C24
SDHC2_DAT1
↔
A4
SDHC2_DAT1
1,8V
B23
SDHC2_DAT2
↔
A5
SDHC2_DAT2
1,8V
A24
SDHC2_DAT3
↔
B2
SDHC2_DAT3
1,8V
C26
SDHC2_DAT4
↔
B2
SDHC2_DAT4
1,8V
B27
SDHC2_DAT5
↔
B4
SDHC2_DAT5
1,8V
A26
SDHC2_DAT6
↔
B5
SDHC2_DAT6
1,8V
A27
SDHC2_DAT7
↔
B6
SDHC2_DAT7
1,8V
B25
SDHC2_CMD
↔
M5
SDHC2_CMD
1,8V
A25
SDHC2_CLK
→
M6
SDHC2_CLK
1,8V
C25
SDHC2_DS
→
H5
SDHC2_DS
1,8V
Table 4-10 eMMC Flash: pin assignments
