Possible Modifications
©
2009 Microchip Technology Inc.
DS51834A-page 23
Figure 3-4 shows a SOIC-8 op amp soldered onto the 8-Pin SOIC/MSOP/TSSOP/DIP
Evaluation Board available from Microchip Technology Inc. The two interconnect strips
on the bottom are soldered into the through holes for the DIP-8 socket. Figure 3-5
shows this board plugged into the MCP651 Input Offset Evaluation Board.
FIGURE 3-4:
Op Amp in SOIC-8 Package and Connector Headers Soldered to
Adaptor PCB.
FIGURE 3-5:
Adaptor Board Connected to the MCP651 Input Offset Evaluation
Board.
Note 1:
Build the adaptor board in the following sequence. Insert the interconnect
headers into the DIP-8 socket on the MCP651 Input Offset Evaluation
Board. Place the SOIC8EV board on the top of the interconnect headers,
while maintaining the correct pin orientation. Solder the headers to the
top board. Clip the pins flush with the top surface of the SOIC8EV board,
then solder the (SOIC-8) op amp on the top.
2:
See Table B-4 for part numbers of this board and its components.
Front
View
Back
View
