MCP401XEV Evaluation Board User’s Guide
DS51888A-page 12
©
2010 Microchip Technology Inc.
2.2
FEATURES
The MCP401XEV Evaluation Board has the following features:
• MCP40D18-103AE/LT is installed (I
2
C address of 7Ch)
• 0
Ω
resistors connect MCP40D18 VDD and VSS signals to the appropiate Power
or Ground plane (see Figure 2-2)
• 0
Ω
resistors connect MCP40D18 A terminal signal to Power plane,
Resistor Network is in a voltage divider configuration (see Figure 2-2)
• Through-hole connection terminal (Orange) for the Wiper pin
• Connection terminals for all device pins (either through-hole or surface-mount)
• Footprints for optional passive components (SMT 805 footprint) for:
- Power supply filtering (C
1
and C
2
footprints)
- Device bypass capacitor (RxD footprint for device pin connected to V
DD
)
• Silk-screen area to write specifics of implemented circuit (on back of PCB), such
as MCP4018 10 k
Ω
• PICkit Serial Analyzer Header
The included SC70EV Board has the following features:
• Connection terminals may be either through-hole or surface-mount
• Three package type footprints supported:
- SC70-6
- SC70-5
- SC70-3
- SOT-23-8
- SOT-23-6
- SOT-23-5
- SOT-23-3
- DIP-8 (300 millimeter spacing)
• Footprints for optional passive components (SMD 805 footprint) for:
- Power supply filtering (C
1
and C
2
footprints)
- Device bypass capacitor (RxD footprint for device pin connected to V
DD
)
- Output filtering (RxD footprint)
- Output pull-up resistor (RxU footprint)
- Output pull-down resistor (RxD footprint)
- Output loading resistor (RxD footprint)
• Silk-screen area to write specifics of implemented circuit (on back of PCB), such
as MCP4018 10 k
Ω
• Can be used for SC70 or SOT-23 to DIP-8 converter
• PICkit Serial Analyzer / PICkit 2 Programming (ICSP) Header
Summary of Contents for MCP401XEV
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