PAC1921 High-Side Current/Power Sensor Evaluation Board User’s Guide
DS50002376A-page 6
2015 Microchip Technology Inc.
Chapter 4. Software Description
4.1.1 Tips for Using the Evaluation Board GUI ...................................................28
4.2.1 Panel Control Section .................................................................................29
4.2.2 Main Configuration Panel............................................................................31
4.2.3 Overflow Status Panel ................................................................................32
4.2.4 R
sense
Panel ...............................................................................................32
4.2.5 Panel and Integration Control Panel ...........................................................32
4.2.6 EVB Demo Configuration Panel..................................................................33
4.3.1 Vbus & Vsense Tab ....................................................................................34
4.3.2 Vbus, Vsense and Vpower Tabs.................................................................35
4.3.3 Calculations/File IO Tab..............................................................................36
4.3.4 Integration Table Tab..................................................................................38
4.4.1 Power Pin-Controlled Integration Example .................................................39
4.4.2 Power Free-Run Integration Example.........................................................42
Appendix A. Schematic and Layouts
A.1 Introduction ................................................................................................... 47
A.2 Board – PAC1921 Current Shunt and Power Monitor Schematic................. 48
A.3 Board – USB Bridge and Sig Gen Schematic............................................... 49
A.4 Board – Top Silk ........................................................................................... 50
A.5 Board – Top Copper and Silk........................................................................ 50
A.6 Board – Top Copper ..................................................................................... 51
A.7 Board – Bottom Copper ................................................................................ 51
A.8 Board – Bottom Copper and Silk .................................................................. 52
A.9 Board – Bottom Silk ...................................................................................... 52
Appendix B. Bill of Materials (BOM) ...........................................................................53
Worldwide Sales and Service .....................................................................................56
