Micro Crystal
Ultra Small Real-Time Clock Module with I
2
C-Bus Interface
RV-8263-C7
January 2019
3/61
Rev. 1.0
5.
I
2
C INTERFACE ............................................................................................................................................ 39
BIT TRANSFER ....................................................................................................................................... 39
5.1.
START AND STOP CONDITIONS .......................................................................................................... 39
5.2.
DATA VALID ............................................................................................................................................ 40
5.3.
SYSTEM CONFIGURATION .................................................................................................................... 40
5.4.
ACKNOWLEDGE ..................................................................................................................................... 41
5.5.
SLAVE ADDRESS ................................................................................................................................... 42
5.6.
WRITE OPERATION ................................................................................................................................ 42
5.7.
READ OPERATION AT SPECIFIC ADDRESS ....................................................................................... 43
5.8.
READ OPERATION ................................................................................................................................. 43
5.9.
6.
ELECTRICAL SPECIFICATIONS ................................................................................................................ 44
ABSOLUTE MAXIMUM RATINGS .......................................................................................................... 44
6.1.
OPERATING PARAMETERS .................................................................................................................. 45
6.2.
OSCILLATOR PARAMETERS ................................................................................................................ 48
6.3.
XTAL FREQUENCY VS. TEMPERATURE CHARACTERISTICS ................................................... 48
6.3.1.
I
2
C-BUS CHARACTERISTICS ................................................................................................................. 49
6.4.
7.
APPLICATION INFORMATION ................................................................................................................... 50
OPERATING RV-8263-C7 ....................................................................................................................... 50
7.1.
OPERATING RV-8263-C7 WITH BACKUP CAPACITOR ...................................................................... 51
7.2.
8.
PACKAGE .................................................................................................................................................... 52
DIMENSIONS AND SOLDER PAD LAYOUT .......................................................................................... 52
8.1.
RECOMMENDED THERMAL RELIEF ............................................................................................. 52
8.1.1.
MARKING AND PIN #1 INDEX ................................................................................................................ 53
8.2.
9.
MATERIAL COMPOSITION DECLARATION & ENVIRONMENTAL INFORMATION ............................... 54
HOMOGENOUS MATERIAL COMPOSITION DECLARATION ............................................................. 54
9.1.
MATERIAL ANALYSIS & TEST RESULTS ............................................................................................ 55
9.2.
RECYCLING MATERIAL INFORMATION .............................................................................................. 56
9.3.
ENVIRONMENTAL PROPERTIES & ABSOLUTE MAXIMUM RATINGS ............................................. 57
9.4.
10.
SOLDERING INFORMATION ...................................................................................................................... 58
11.
HANDLING PRECAUTIONS FOR MODULES WITH EMBEDDED CRYSTALS........................................ 59
12.
PACKING & SHIPPING INFORMATION ..................................................................................................... 60
13.
COMPLIANCE INFORMATION ................................................................................................................... 61
14.
DOCUMENT REVISION HISTORY .............................................................................................................. 61
