RATE VS. POWER
CO PPER 2" Dia., 3" D ist.
0.00
5.00
10.00
15.00
20.00
25.00
30.00
35.00
40.00
0
50 100 150 200 250 300 350 400 450 500
Watts RF
Å
/
s
e
c
When gathering rate data, it is also
desirable to take rates at different
power levels. These values can be
plotted to produce a graph similar to
the one shown.
Please Note
: For approximating DC
rates, multiply by 1.75.
RELATIVE SPUTTERING RATES OF
50 MATERIALS
The following list of materials and
their relative sputtering rates are
normalized to copper as 1.00. Copper is a convenient and readily available material to use
as a reference. Once the rate of copper is known, then the other 49 may be approximated.
Please Note: These rates may vary from those of other periodicals, due to the conditions
under which the rates were taken.
Element (or compound) Cu = Rate of 1.00
Ag
2.06
Gd
1.17
Rh
0.74
Al
0.73
Ge
1.05
Ru
0.66
Al
2
O3
0.15
Glass
0.23
Sb
3.68
Au
1.76
Hf
0.67
Si
0.39
Be
0.22
Ir
0.61
SiC
0.36
Bi
10.00
Mg
0.26
SiO
0.27
C
0.05
MgF
0.03
SiO2
0.45
CdS (1010)
2.39
Mn
0.99
Sm
1.14
CdTe
0.64
Mo
0.53
Sn
1.38
Co
0.58
Nb
0.44
Ta
0.43
Cr
0.60
Ni
0.65
Th
0.84
Cu
1.00
Os
0.5
Ti
0.38
Dy
1.18
Pb
3.52
U
0.73
Er
1.00
Pd
1.31
V
0.38
Fe
0.56
Pt
0.9
W
0.39
GaSa (110)
1.70
Rb
4.55
Y
0.95
Re
0.53
Zr
0.65
18
Summary of Contents for MAK 1.3 inch
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Page 52: ...1 Simplicity in Sputtering INTRODUCING Planar Magnetron Sputtering Source The MAK...
Page 53: ...2 Simplicity in Sputtering Target Installation on the MAK Target Keeper Cathode Magnets...
Page 55: ...4 Simplicity in Sputtering MAK without target installed Target Keeper Cathode Adjustable Anode...