Logika Technologies Inc. Model HMD-SM Operator’s Manual
Rev 2.1 Dec-
13
Web
:
www.logikatech.com
Phone
: 905-829-5841
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: 905-829-8787
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| 6
Detects low temperature and low emissivity targets in harsh environments; even with
infrared reflection or roller heat radiation interference.
Pulse signal treatment circuit design lessens detector power consumption and temperature
drift.
3. Location and Mounting
3.1 Sensor Location
The ideal location should allow the HMD scanning field to cover the entire process line,
protect it from absorbing excessive heat, and be close enough for the detector to get
sufficient infrared energy from the target.
Mounting Distance-
Check the HMD mounting distance listed on table 3 for different
targets. Find the size of the target, select an approximate mounting distance. Use Figure 2.3
for calculating the scanning field and select the ideal scanning angle (10
o
, 30
o
, or 50
o
) to
make sure the sensor’s scanning field covers the entire process area. The vertical scanning
field should be oriented across the width of the process line for best coverage.
Target
HMD Distance
Target
HMD Distance
Wire rod, 5 -12 mm
0.2 - 3.0 m
Steel Strip
0.6 - 2m
Bar, 10x10-40x40 mm
0.2 - 4.0 m
Thin Plate
1.0 - 6.0m
Square Billet
0.5 - 6.0 m
Thick Plate
1.0 - 8.0m
Large Billet(Bloom)
>2.0 m
Slab
>2.0m
Table 3
Interference-
Reduce or eliminate background infrared radiation sources, such as other hot
processes behind the target and reflected sunlight:
1.
Select the appropriate scanning angle when originally placing order to avoid “over-
scanning”.
2.
Gradually reduce the sensitivity adjustment on the HMD-SM’s control panel until the
background interference is not detected (when no target metal is within the scanning field).
See the “
Operation
” chapter in this manual for additional details.
3.
In occasional severe environments, install a heat proof enclosure around the HMD to
protect it from overheating and use ventilation to drive away particulate and vapor.
Other considerations for installation
1.
Locate the HMD to reduce interfering infrared sources and choose a detection field that
minimizes the presence of dirt, smoke and water vapor or other infrared absorbing
chemicals.
2.
Only part of the target needs to be in the sensor’s scanning field to trigger a hot metal
output signal.