LTC2944
18
2944fa
For more information
www.linear.com/LTC2944
package DescripTion
DD Package
8-Lead Plastic DFN (3mm
×
3mm)
(Reference LTC DWG # 05-08-1698 Rev C)
3.00
±
0.10
(4 SIDES)
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON TOP AND BOTTOM OF PACKAGE
0.40
±
0.10
BOTTOM VIEW—EXPOSED PAD
1.65
±
0.10
(2 SIDES)
0.75
±
0.05
R = 0.125
TYP
2.38
±
0.10
1
4
8
5
PIN 1
TOP MARK
(NOTE 6)
0.200 REF
0.00 – 0.05
(DD8) DFN 0509 REV C
0.25
±
0.05
2.38
±
0.05
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
1.65
±
0.05
(2 SIDES)
2.10
±
0.05
0.50
BSC
0.70
±
0.05
3.5
±
0.05
PACKAGE
OUTLINE
0.25
±
0.05
0.50 BSC
Please refer to
http://www.linear.com/product/LTC2944#packaging
for the most recent package drawings.
