1-4
SERVICING PRECAUTIONS
CAUTION: Before servicing the VCR+DVD RECORDER
covered by this service data and its supplements and
addends, read and follow the
SAFETY PRECAUTIONS.
NOTE
: if unforeseen circumstances create conflict between
the following servicing precautions and any of the safety
precautions in this publications, always follow the safety pre-
cautions.
Remember Safety First :
General Servicing Precautions
1. Always unplug the VCR+DVD RECORDER AC power cord
from the AC power source before:
(1)
Removing or reinstalling any component, circuit board,
module, or any other assembly.
(2)
Disconnecting or reconnecting any internal electrical
plug or other electrical connection.
(3)
Connecting a test substitute in parallel with an electro-
lytic capacitor.
Caution
: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an
explosion hazard.
2.
Do not spray chemicals on or near this VCR+DVD
RECORDER or any of its assemblies.
3. Unless specified otherwise in this service data, clean elec-
trical contacts by applying an appropriate contact cleaning
solution to the contacts with a pipe cleaner, cotton-tipped
swab, or comparable soft applicator.
Unless specified otherwise in this service data, lubrication
of contacts is not required.
4. Do not defeat any plug/socket B+ voltage interlocks with
whitch instruments covered by this service manual might
be equipped.
5. Do not apply AC power to this VCR+DVD RECORDER
and / or any of its electrical assemblies unless all solidstate
device heat sinks are correctly installed.
6. Always connect the test instrument ground lead to an
appropriate ground before connecting the test instrument
positive lead. Always remove the test instrument ground
lead last.
Insulation Checking Procedure
Disconnect the attachment plug from the AC outlet and turn
the power on. Connect an insulation resistance meter
(500V)
to the blades of the attachment plug. The insulation resist-
ance between each blade of the attachment plug and acces-
sible conductive parts (Note 1) should be more than
1Mohm.
Note 1
: Accessible Conductive Parts include Metal panels,
Input terminals, Earphone jacks,etc.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged
easily by static electricity. Such components commonly are
called Electrostatically Sensitive (ES) Devices. Examples of
typical ES devices are integrated circuits and some field
effect transistors and semiconductor chip components.
The following techniques should be used to help reduce the
incidence of component damage caused by static electricity.
1. Immediately before handling any semiconductor compo-
nent or semiconductor-equipped assembly, drain off any
electrostatic charge on your body by touching a known
earth ground. Alternatively, obtain and wear a commer-
cially available discharging wrist strap device, which should
be removed for potential shock reasons prior to applying
power to the unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such
as aluminum foil, to prevent electrostatic charge buildup or
exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsol-
der ES devices.
4. Use only an anti-static solder removal device. Some solder
removal devices not classified as “anti-static” can generate
electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
an electrical charge sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads
electrically shorted together by conductive foam, aluminum
foil,or comparable conductive material).
7. Immediately before removing the protective material from
the leads of a replacement ES device, touch the protective
material to the chassis or circuit assembly into which the
device will be installed.
Caution: Be sure no power is applied to the chassis or
circuit, and observe all other safety precautions.
8.
Minimize bodily motions when handling unpackaged
replacement ES devices. (Normally harmless motion such
as the brushing together of your clothes fabric or the lifting
of your foot from a carpeted floor can generate static elec-
tricity sufficient to damage an ES device.)
Summary of Contents for RCT689H
Page 11: ...1 10 MEMO ...
Page 19: ...2 8 MEMO ...
Page 36: ...3 17 6 7 5 SPDIF_OUT IC1101 6 7 A OUT_R A OUT_L 5 ...
Page 37: ...3 18 MEMO ...
Page 39: ...3 21 3 22 2 SYSTEM BLOCK DIAGRAM ...
Page 43: ...3 29 3 30 6 TUNER BLOCK DIAGRAM ...
Page 53: ...3 49 3 50 8 HDMI CIRCUIT DIAGRAM HDMI MODEL ONLY ...
Page 55: ...3 53 3 54 10 KEY CIRCUIT DIAGRAM ...
Page 59: ...3 61 3 62 PRINTED CIRCUIT BOARD DIAGRAMS 1 VCR P C BOARD TOP VIEW ...
Page 60: ...3 63 3 64 VCR P C BOARD BOTTOM VIEW ...
Page 61: ...3 65 3 66 2 SMPS P C BOARD TOP VIEW BOTTOM VIEW 3 HDMI P C BOARD TOP VIEW BOTTOM VIEW ...
Page 62: ...3 67 3 68 4 KEY P C BOARD TOP VIEW BOTTOM VIEW ...
Page 63: ...3 69 3 70 MEMO MEMO ...
Page 72: ...3 79 2 DV BLOCK TPA TPB 4 3 2 1 1 2 3 4 ...
Page 73: ...3 80 3 USB BLOCK D 1 2 1 2 ...
Page 80: ...3 93 3 94 CIRCUIT DIAGRAMS 1 MPEG CIRCUIT DIAGRAM ...
Page 81: ...3 95 3 96 2 DDR LATCH FLASH RESET CIRCUIT DIAGRAM ...
Page 82: ...3 97 3 98 3 DV1394 INTERFACE CON CIRCUIT DIAGRAM ...
Page 83: ...3 99 3 100 4 RF IC MOTOR DRIVE IC CIRCUIT DIAGRAM ...
Page 84: ...3 101 3 102 5 DSP CIRCUIT DIAGRAM ...
Page 86: ...3 105 3 106 PRINTED CIRCUIT BOARD DIAGRAMS 1 VDR LOADER P C BOARD TOP VIEW BOTTOM VIEW ...
Page 87: ...3 107 3 108 MEMO MEMO ...
Page 119: ...4 32 MEMO ...
Page 136: ...5 17 2 DISC SPECIFICATION 3 DISC MATERIALS 1 DVD ROM ...
Page 141: ...5 22 3 Layout of DVD RW disc ...
Page 142: ...5 23 4 Layout of DVD R RW disc ...
Page 165: ...5 46 MEMO ...