5: Carrier Board
Snapdragon 845 HDK Hardware Development Kit User Guide
35
Camera connector
The HDK845 development kit supports three 4-lane MIPI camera interfaces via a 120pin connector,
it also supports one 2-lane MIPI camera interface via a 23-pin connector on the Processor board.
The following are some features of the camera connectors:
3 x 4 lane MIPI CSI signals, CSI0, CSI1 and CSI2
1 x 2 lane MIPI CSI signals, CSI3 reserved on Processor board
Support for 3D camera configuration
Separate I2C control (CCI0, CCI1)
Self-regulated camera modules can be powered with 3.3V power (MB_VREG_3P3)
Uses Amphenol 11826-ACA connector for exposing MIPI, MCLK, CCI, GPIOs and Power rails.
Use Amphenol 11828-1CA mating connector to access these signals.
Figure 5-15 Camera Connector (J1701)
Table 5-12 MIPI CSI Camera Connector Pinouts (J1701)
Pin#
Signal
Description
Pin#
Signal
Description
A1
CAM_VREG_3P3
3.3V power supplier
B1
DGND
A2
CAM_VREG_3P3
3.3V power supplier
B2
CCI_I2C_SDA0
SDA GPIO17
A3
CAM_VREG_3P3
3.3V power supplier
B3
CCI_I2C_SCL0
SDA GPIO18
A4
DGND
B4
DGND
A5
CAM_S5A
2.04V power supplier
B5
CCI_I2C_SDA1
SDA GPIO19
A6
P1V8_CAM_IOVDD
1.8V power supplier
B6
CCI_I2C_SCL1
SDA GPIO20
A7
DGND
B7
DGND
A8
FLASH_LED1
FLASHLED1
B8
CAM_S3A
1.35V power
supplier
A9
FLASH_LED1
FLASHLED1
B9
CAM_S3A
1.35V power
supplier
A10 DGND
B10 DGND
