4: Processor Board
Snapdragon 845 HDK Hardware Development Kit User Guide
15
4.1 Processor Board Mechanical Properties
Table 4-1 HDK845 Processor Board Mechanical Properties
Dimension
42 cm
2
(60 mm x 70 mm)
Interface
two 240-pin high speed board-to-board connector
Thermal
A top side heat sink and a bottom side heat conductive metal plate are
installed by default.
4.2 Hardware Specification
Table 4-2 HDK845 Hardware Features
Subsystem /
Connectors
Feature Set
Description
Specification
Chipset
SDA845
Qualcomm® 845 Snapdragon
TM
Processor
64-bit applications
processor (Kryo 385) with
2 MB L3 cache
Quad high-performance
Kryo cores targeting up to
2.6 GHz – Gold cluster
with 256 kB L2 cache per
core
Quad low-power Kryo
cores targeting up to 1.7
GHz – Silver cluster with
128 kB L2 cache per core
