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GENERAL
PHONE-AMP F399 includes one or two
modules, each with a double stereo head-
phone amplifier.
Different to most comparable models its overall
voltage gain may be altered internally to match
the specific needs of different headphones.
Due to this “OPTI-MODE” called technique,
this headphone amplifier is able to drive nearly
all existing head-phones from 8 … 600 ohms
load impedance.
Because of its noise- and THD-optimized
circuitry layout, PHONE-AMP F399 covers
high quality demands.
HINT:
Ex works PHONE-AMP F399 is always set to
low gain mode.
Each modules´ outstanding features comprise:
-
balanced inputs via XLR
-
additional command channel with
balanced inputs
-
additional unbalanced inputs and
outputs via TRS jacks
-
2 stereophonic amplifiers with dedicated
volume and balance control
and Clip/Temp monitoring
-
2 x 2 headphone sockets with split function
-
additional back mounted outputs
via TRS jacks
THE CASE
The grounded case is made of 1 -2 mm thick
stainless steel. This provides high mechanical
stability and resistance against rough handling.
The cases surfaces are not treated with any
material, so providing excellent electrical con-
ductances for optimum EMC characteristics.
THE POWER SUPPLY
Mains is connected via a built-in IEC-CEE
mains socket. If necessary, mains voltage can
be internally switched from 230 to 115 V.
The "POWER"-switch is situated on the front
panel. Power status is displayed by a LED
situated below the power switch.
A toroidal transformer delivers the internal
supply voltages. They are stabilized by secon-
dary switch mode regulators.
A possible overload of the power supply is
signalized by the flashing "POWER"-LED.
THE MAINS FUSE
The 0,25 AT fuse is internally soldered in place
on the power supply PCB.
ATTENTION !!
FOLLOW THE SAFETY INSTRUCTIONS:
A blown fuse may refer to internal problems
and should only been replaced during qualified
servicing works !!