44
3BA00044-00 • 2013-05-23 • Rev. 4
ersa DIGITAL 2000 A
4.4
Instructions for desoldering using CHIP TOOL
• Using a small brush, wet the clean and grease-free soldering joints of
the components to be desoldered with flux.
• Take the CHIP TOOL from the soldering iron holder.
• Before soldering, lightly pierce the desoldering inserts on the dry
sponge so that they again have a metallic shine. This will prevent
oxidized solder or burnt flux residue from contaminating the solder
-
ing joint. Lightly wet with new solder
in order to achieve a good heat
transfer
between the desoldering inserts and the component pins.
Note:
In order to prevent the desoldering inserts from becoming passive after
the cleaning process, they must be wetted by immediate desoldering or
by again tin-coating them with solder wire.
Passive desoldering inserts
result in longer desoldering times.
• Place the open desoldering CHIP TOOL on the component to be desol
-
dered and close them slightly in order to establish sufficient thermal
contact with the soldering joints.
• After melting the solder, remove the compo
n
ent from the printed-
circuit board and place it on a heat-resistant pad. Wipe small compo
-
nents on a
viscose sponge.
Caution:
In the case of components bonded with adhesive, do not forcefully
twist them as this could damage the ceramic heater. Apply heat to the
component until the adhesive is softened and the component can easily
be removed.
• Replace the CHIP TOOL in the soldering iron holder when not in use.
You can receive a detailed process description ‘SMD Removal‘ free of charge upon re
-
quest from Ersa.
Starting operation
