ELECTRICAL CONNECTIONS
4
17
DK37/M8 - H250/M8
www.krohne.com
11/2017 - 4002616802 - AD DK37 NEPSI Ex ia R02 en
4.4 Grounding and equipotential bonding
If the device is not sufficiently electrostatically grounded via the process cables, an additional
ground connection must be established using the ground terminal
1
. The position of the ground
terminal is illustrated below. This connection only ensures electrostatic grounding of the device
and does not meet the requirements for equipotential bonding.
For the H250/../M8.G/.. designs also ensure proper fit of the mounting screws
2
.
Any existing cable shields and all cores that are not used must be carefully insulated against
each other and against ground (test voltage
≥
500 V
eff
) according to applicable installation
regulations.
