Section 8: Grading and binning resistors
DMM6500 6½ Digit Multimeter User's Manual
8-2
DMM6500-900-01Rev. A / April 2018
Device connections
This example application uses a DMM6500 to perform benchtop binning operations. Output signals
(grading results) are sent from the instrument to the component handler, which bins the devices.
The figure below shows the rear-panel connections from the DMM6500 to the test fixture and the
digital lines to the component handler. The optional GPIB communication card connects the controller
and the component handler.
Digital lines and GPIB communications require the KTTI-GPIB communications accessory card.
Figure 41: Device connections for component binning
To prevent electric shock, test connections must be configured such that the user cannot
come in contact with test leads or any device under test (DUT) that is in contact with the
conductors. It is good practice to disconnect DUTs from the instrument before powering the
instrument. Safe installation requires proper shields, barriers, and grounding to prevent
contact with test leads.
There is no internal connection between protective earth (safety ground) and the LO
terminals of the DMM6500. Therefore, hazardous voltages (more than 30 V
RMS
) can appear on
LO terminals. This can occur when the instrument is operating in any mode. To prevent
hazardous voltage from appearing on the LO terminals, connect the LO terminal to protective
earth (safety ground) if your application allows it. You can connect the LO terminal to the
chassis ground terminal on the front panel or the chassis ground screw terminal on the rear
panel. Note that the front-panel terminals are isolated from the rear-panel terminals.
Therefore, if you are using the front-panel terminals, ground to the front-panel LO terminal. If
using the rear-panel terminals, ground to the rear panel LO terminal. Failure to follow these
guidelines can result in injury, death, or instrument damage.
