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4.1
Introduction...................................................................................................................................................... 4-1
4.2
Power limits...................................................................................................................................................... 4-1
4.3
Mainframe control of matrix card ................................................................................................................. 4-1
4.3.1
Channel assignments .............................................................................................................................. 4-2
4.3.2
Front panel control .................................................................................................................................. 4-4
4.3.3
IEEE-488 bus operation........................................................................................................................... 4-4
4.4
Matrix switching examples ............................................................................................................................ 4-5
4.4.1
Thick film resistor network testing ....................................................................................................... 4-5
4.4.2
Transistor testing ................................................................................................................................... 4-10
4.5
Measurement considerations ....................................................................................................................... 4-13
4.5.1
Path isolation.......................................................................................................................................... 4-13
4.5.2
Magnetic fields....................................................................................................................................... 4-14
4.5.3
Radio frequency interference............................................................................................................... 4-14
4.5.4
Ground loops ......................................................................................................................................... 4-14
4.5.5
Keeping connectors clean ..................................................................................................................... 4-15
4.5.6
AC frequency response......................................................................................................................... 4-15
5.1
Introduction..................................................................................................................................................... 5-1
5.2
Handling and cleaning precautions.............................................................................................................. 5-1
5.3
Performance verification ................................................................................................................................ 5-2
5.3.1
Environmental conditions ...................................................................................................................... 5-2
5.3.2
Recommended equipment ..................................................................................................................... 5-2
5.3.3
Matrix card connections ......................................................................................................................... 5-3
5.3.4
Channel resistance tests .......................................................................................................................... 5-3
5.3.5
Offset current tests................................................................................................................................... 5-4
5.3.6
Contact potential tests............................................................................................................................. 5-6
5.3.7
Path isolation tests ................................................................................................................................... 5-7
5.3.8
Differential and common-mode isolation tests ................................................................................... 5-9
5.4
Special handling of static-sensitive devices ............................................................................................... 5-11
5.5
Principles of operation .................................................................................................................................. 5-12
5.5.1
Block diagram ........................................................................................................................................ 5-12
5.5.2
ID data circuits ....................................................................................................................................... 5-13
5.5.3
Relay control........................................................................................................................................... 5-13
5.5.4
Relay power control .............................................................................................................................. 5-14
5.5.5
Power-on safeguard .............................................................................................................................. 5-14
5.6
Troubleshooting............................................................................................................................................. 5-15
5.6.1
Troubleshooting equipment................................................................................................................. 5-15
5.6.2
Troubleshooting access ......................................................................................................................... 5-15
5.6.3
Troubleshooting procedure.................................................................................................................. 5-15
6.1
Introduction...................................................................................................................................................... 6-1
6.2
Parts lists ............................................................................................................................................................6-1
6.3
Ordering information...................................................................................................................................... 6-1
6.4
Factory service.................................................................................................................................................. 6-1
6.5
Component layouts and schematic diagrams ............................................................................................. 6-2
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Summary of Contents for 7012-S
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