P1A
T1A
GEB10295A1
B615
B610
R703
R698
R688
MARK
UL
PbF
C607
B608
C605
B605
B614
D624
B613
R702
R701
R649
B685
C609
R699
B642
B606
B641
C662
L604
RA663
R694
CN601
CN603
L687
L686
L685
EN601
R631
R635
R633
R634
R632
R615
R613
R614
B603
B602
B601
R648
D622
R617 R616
GND
VDD
LWR
PTTX
E8-EPM
E8-BUSY
CNVSS
PTCK
RST
PTRX
R602
R601
R643
R604
D618
C603
Q601
C601
C602
CN602
C670
IC681
R605
J601
C640
C668
R603
R607 R608 R609
R610
R611
R612
IC601
IC661
X661
RA664
RA662
RA661
RA665
R670
R625
R629
R651
R662
R637
R636
R671
R667
R639
R620
R619
R661
R618
R656
R665
R626
R638
R690
R628
R676
R674
R657
R681
R677
R680
R627
R660
R659
R663
R685
R684
R672
R673
R675
R666
R682
R658
R655
R654
R622
R623
R652
R640
R645
R669
R679
R683
R606
R621
R653
R664
R650
R695
R696
R624
R697
R630
R646
R647
R693
R686
R687
R691
R668
R642 R641
R692
Q603
Q602
L640
L661
L603
IC602
D630
D681
D615
D617
D640
D641
D645
D613
D611
D614
D612
D651
C604
C667
C682
C665
C659
C652
C666
C681
C642
C671
C645
C646
C664
C651
C649 C648
C650
C663
C647
C658
C621
C622
C657
C656
C655
C654
C684
C685
C641
C653
C669
C661
<Switch board>
(Lead free solder used in the board (material : Sn-Ag-Cu, melting point : 219 Centigrade))
(Lead free solder used in the board (material : Sn-Cu, melting point : 230 Centigrade))
created date:2010-03-17
No.MA475
(No.MA475<Rev.001>)14/21
Summary of Contents for KW-XG700J
Page 27: ......