2
Manual Revision Information
Reversion
Revision History
Date
1.0
First Release
Oct 2000
Item Checklist
5
613DF
5
Cable for IDE/Floppy
5
CD for motherboard utilities
□
Cable for USB Port 3/4 (Option)
5
Cable for COM2
5
613DF User’s Manual
Intel
Processor Family
Thermal Solutions
As processor technology pushes to faster speeds and higher performance, thermal management
becomes increasingly crucial when building computer systems. Maintaining the proper
thermal environment is key to reliable, long-term system operation. The overall goal in
providing the proper thermal environment is keeping the processor below its specified
maximum case temperature. Heatsinks induce improved processor heat dissipation through
increased surface area and concentrated airflow from attached fans. In addition, interface
materials allow effective transfers of heat from the processor to the heatsink. For optimum
heat transfer, Intel recommends the use of thermal grease and mounting clips to attach the
heatsink to the processor.
When selecting a thermal solution for your system, please refer to the website below for
collection of heatsinks evaluated and recommended by Intel for use with Intel processors.
Vendor list for heatsink and fan of
Pentium® !!! processor
, please visit
：
http://developer.intel.com/design/Pentiumiii/components/index.htm
Vendor list for heatsink and fan of
Intel®Celeron™ processor
, please visit
：
http://developer.intel.com/design/celeron/components/index.htm
