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15
14
Multiprocessing
– Distributed On-Chip Bus Arbitration for Glueless, Parallel Bus Connect Between Two ADSP-21065Ls
Plus Host
– 132 Mbytes/s Transfer Rate Over Parallel Bus
Serial Ports
– Independent Transmit and Receive Functions
– Programmable 3-Bit to 32-Bit Serial Word Width
– I
2
S Support Allowing Eight Transmit and Eight Receive Channels
– Glueless Interface to Industry Standard Codecs
– TDM Multichannel Mode with µ-Law/A-Law Hardware Companding
– Multichannel Signaling Protocol
BLOCK DIAGRAM
PIN DESCRIPTIONS
ADSP-21065L pin definitions are listed below. Inputs identified as synchronous (S) must meet timing
requirements with respect to CLKIN (or with respect to TCK for TMS, TDI). Inputs identified as
asynchronous (A) can be asserted asynchronously to CLKIN (or to TCK for TRST).
Unused inputs should be tied or pulled to VDD or GND, except for ADDR
23-0
, DATA
31-0
, FLAG
11-0
, SW, and
inputs that have internal pull-up or pull-down resistors (CPA, ACK, DTxX, DRxX, TCLKx, RCLKx, TMS, and
TDI)–these pins can be left floating. These pins have a logic-level hold circuit that prevents the input from
floating internally.
I=Input
S=Synchronous
P=Power Supply
(O/D)=Open Drain
O=Output
A=Asynchronous
G=Ground
(A/D)=Active Drive
T=Three-state (when SBTS is asserted, or when the ADSP-2106x is a bus slave)
Pin
Type
Function
ADDR
23-0
I/O/T
External Bus Address.
The ADSP-21065L outputs addresses for external
memory and peripherals on these pins. In a multiprocessor system the bus
master outputs addresses for read/writes of the IOP registers of the other
ADSP-21065L. The ADSP-21065L inputs addresses when a host processor
or multiprocessing bus master is reading or writing its IOP registers.
DATA
31-0
I/O/T
External Bus Data.
The ADSP-21065L inputs and outputs data and
instructions on these pins. The external data bus transfers 32-bit single-
precision floating-point data and 32-bit fixed-point data over bits 31-0. 16-bit
short word data is transferred over bits 15-0 of the bus. Pull-up resistors on
unused DATA pins are not necessary.
MS
3-0
I/O/T
Memory Select Lines.
These lines are asserted as chip selects for the
corresponding banks of external memory. Internal ADDR
25-24
are decoded
into MS
3-0
. The MS
3-0
lines are decoded memory address lines that change
at the same time as the other address lines. When no external memory
access is occurring the MS
3-0
lines are inactive; they are active, however,
when a conditional memory access instruction is executed, whether or not
the condition is true. Additionally, an MS
3-0
line which is mapped to SDRAM
may be asserted even when no SDRAM access is active. In a
multiprocessor system, the MS
3-0
lines are output by the bus master.
RD
I/O/T
Memory Read Strobe.
This pin is asserted when the ADSP-21065L reads
from external memory devices or from the IOP register of another ADSP-
21065L. External devices (including another ADSP-21065L) must assert RD
to read from the ADSP-21065L’s IOP registers. In a multiprocessor system,
RD is output by the bus master and is input by another ADSP-21065L.
WR
I/O/T
Memory Write Strobe.
This pin is asserted when the ADSP-21065L writes
to external memory devices or to the IOP register of another ADSP-21065L.
External devices must assert WR to write to the ADSP-21065L’s IOP
registers. In a multiprocessor system, WR is output by the bus master and is
input by the other ADSP-21065L.
SW
I/O/T
Synchronous Write Select.
This signal interfaces the ADSP-21065L to
synchronous memory devices (including another ADSP-21065L). The
ADSP-21065L asserts SW to provide an early indication of an impending
write cycle, which can be aborted if WR is not later asserted (e.g., in a
conditional write instruction). In a multiprocessor system, SW is output by the
bus master and is input by the other ADSP-21065L to determine if the
multiprocessor access is a read or write. SW is asserted at the same time as
the address output.
ACK
I/O/S
Memory Acknowledge.
External devices can deassert ACK to add wait
states to an external memory access. ACK is used by I/O devices, memory
controllers, or other peripherals to hold off completion of an external memory
Summary of Contents for GEQ-1231D
Page 15: ...27 26...
Page 16: ...29 28...
Page 17: ...31 30 BLOCK DIAGRAM WIRING DIAGRAM...
Page 18: ...32...
Page 19: ...34 33 SCHEMATIC DIAGRAM GEQ 1231D FRONT B D...
Page 20: ...36 35 GEQ 2231D FRONT B D 1 2...
Page 21: ...38 37 GEQ 2231D FRONT B D 2 2...
Page 22: ...40 39 IN OUT B D...
Page 23: ...42 41 POWER B D...
Page 24: ...44 43 SHT B D 1 4...
Page 25: ...46 45 SHT B D 2 4...
Page 26: ...48 47 SHT B D 3 4...
Page 27: ...50 49 SHT B D 4 4...
Page 28: ...52 51 EXPLODED CIEW OF CABINET CHASSIS MACHANICAL PARTS LIST...
Page 29: ...54 53...
Page 30: ...56 55 ASS Y DRAWING...
Page 31: ...58 57...
Page 32: ...NOTE...