Thermal/Mechanical Design Guide
33
Thermal Solutions
5. Dimensions of heatsink do not include socket or processor. The 25.5 mm heatsink socket/processor
height (7.729 mm,
Table 4-2
) complies with 33.5mm max height for SSI blade boards
(http://ssiforum.org/).
6. Passive heatsinks. Dow Corning TC-1996 thermal interface material.
5.2
Heat Pipe Considerations
Figure 5-2
shows the orientation and position of the TTV die. The TTV die is sized and
positioned similarly to the processor die.
Figure 5-2.
TTV Die Size and Orientation
Figure 1 -
Side Views of Package with IHS (not to scale)
Cache Cache Cache Cache
Core
Cache
45
19.3
1.0
Package CL
Die CL
NOT TO SCALE
All Dimensions in mm
Summary of Contents for X5550 - Quad Core Xeon
Page 8: ...8 Thermal Mechanical Design Guide ...
Page 12: ...Introduction 12 Thermal Mechanical Design Guide ...
Page 24: ...Independent Loading Mechanism ILM 24 Thermal Mechanical Design Guide Figure 3 3 ILM Assembly ...
Page 26: ...Independent Loading Mechanism ILM 26 Thermal Mechanical Design Guide ...
Page 48: ...Component Suppliers 48 Thermal Mechanical Design Guide ...
Page 82: ...Mechanical Drawings 82 Thermal Mechanical Design Guide ...
Page 88: ...Socket Mechanical Drawings 88 Thermal Mechanical Design Guide ...
