Independent Loading Mechanism (ILM)
22
Thermal/Mechanical Design Guide
3.1.2
ILM Back Plate Design Overview
The unified back plate for 2-socket server and 2-socket Workstation products consists
of a flat steel back plate with threaded studs for ILM attach, and internally threaded
nuts for heatsink attach. The threaded studs have a smooth surface feature that
provides alignment for the back plate to the motherboard for proper assembly of the
ILM around the socket. A clearance hole is located at the center of the plate to allow
access to test points and backside capacitors. An additional cut-out on two sides
provides clearance for backside voltage regulator components. An insulator is pre-
applied.
Back plates for processors in 1-socket Workstation platforms are covered in the Intel
®
Core™ i7-900 Desktop Processor Extreme Edition Series and Intel
®
Core™ i7-900
Desktop Processor Series, Intel
®
Xeon
®
Processor 3500 Series and LGA1366 Socket
Thermal / Mechanical Design Guide.
Figure 3-1.
ILM Cover Assembly
Summary of Contents for X5550 - Quad Core Xeon
Page 8: ...8 Thermal Mechanical Design Guide ...
Page 12: ...Introduction 12 Thermal Mechanical Design Guide ...
Page 24: ...Independent Loading Mechanism ILM 24 Thermal Mechanical Design Guide Figure 3 3 ILM Assembly ...
Page 26: ...Independent Loading Mechanism ILM 26 Thermal Mechanical Design Guide ...
Page 48: ...Component Suppliers 48 Thermal Mechanical Design Guide ...
Page 82: ...Mechanical Drawings 82 Thermal Mechanical Design Guide ...
Page 88: ...Socket Mechanical Drawings 88 Thermal Mechanical Design Guide ...
