Technical Reference
53
Figure 19 shows the height dimensions of the board.
Figure 19. Board Height Dimensions
2.5
Electrical Considerations
2.5.1
Power Supply Considerations
System power requirements will depend on actual system configurations chosen by the
integrator, as well as end user expansion preferences. It is the system integrator’s responsibility
to ensure an appropriate power budget for the system configuration is properly assessed based
on the system-level components chosen.
2.5.2
Fan Header Current Capability
Table 21 lists the current capability of the fan header.
Table 21. Fan Header Current Capability
Fan Header
Maximum Available Current
Processor fan
.25 A
2.6
Thermal Considerations
CAUTION
A chassis with a maximum internal ambient temperature of 58
o
C at the processor fan inlet is
recommended. If the internal ambient temperature exceeds 58
o
C, further thermal testing is
required to ensure components do not exceed their maximum case temperature.
CAUTION
Failure to ensure appropriate airflow may result in reduced performance of both the processor
and/or voltage regulator or, in some instances, damage to the board.
All responsibility for determining the adequacy of any thermal or system design remains solely
with the system integrator. Intel makes no warranties or representations that merely following the
instructions presented in this document will result in a system with adequate thermal performance.
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