Intel MFS5520VI - Multi-Flex Server Compute Module, Specification

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Product Overview Intel® Compute Module MFS5520VI TPS
Revision 1.5
Intel order number: E64311-007
2
2. Product Overview
The Intel
®
Compute Module MFS5520VI is a monolithic printed circuit board with features that
were designed to support the high-density compute module market.
2.1 Intel
®
Compute Module MFS5520VI Feature Set
Table 1. Intel compute module MFS5520VI Feature Set
Feature Description
Processors Support for one or two Intel
®
Xeon
®
Processor 5500 series or two Intel
®
Xeon
®
Processor 5600 series in FC-LGA 1366 Socket B package with up to 95 W Thermal
Design Power (TDP).
ƒ 4.8 GT/s, 5.86 GT/s, and 6.4 GT/s Intel
®
QuickPath Interconnect (Intel
®
QPI)
ƒ Enterprise Voltage Regulator-Down (EVRD) 11.1
Memory Support for 1066/1333 MT/s ECC registered (RDIMM) or unbuffered (UDIMM)
DDR3 memory.
12 DIMMs total across 6 memory channels (3 channels per processor).
Note
: Mixed memory is not tested or supported. Non-ECC memory is not tested and is
not supported in a server environment.
Chipset ƒ Intel
®
5520 Chipset IOH
ƒ Intel
®
82801JR I/O Controller Hub (ICH10R)
On-board
Connectors/Headers External connections:
ƒ Four USB 2.0 ports
ƒ DB-15 Video connector
Internal connectors/headers:
ƒ
One low-profile USB 2x5 pin header to support low-profile USB solid state drives
ƒ
Intel
®
I/O Mezzanine connectors supporting Dual Gigabit NIC Intel
®
I/O Expansion
Module (Optional)
On-board Video On-board ServerEngines* LLC Pilot II Controller
ƒ Integrated 2D Video Controller
ƒ 64 MB DDR2 Memory
On-board Hard Drive
Controller LSI* 1064e SAS controller
LAN Two integrated 1000 Ethernet ports and two optional 1000 Ethernet ports, provided by
the Dual Gigabit NIC mezzanine module.