Datasheet
85
Networking Silicon — GD82559ER
12.
Package and Pinout Information
12.1
Package Information
The GD82559ER is a 196-pin Ball Grid Array (BGA) package. Package dimensions are shown in
Figure 24
. More information on Intel device packaging is available in the Intel Packaging
Handbook, which is available from the Intel Literature Center or your local Intel sales office.
Figure 24. Dimension Diagram for the GD82559ER 196-Pin BGA
Summary of Contents for GD82559ER
Page 6: ...GD82559ER Networking Silicon vi Datasheet...
Page 8: ...GD82559ER Networking Silicon 2 Datasheet...
Page 12: ...GD82559ER Networking Silicon 6 Datasheet...
Page 18: ...GD82559ER Networking Silicon 12 Datasheet...
Page 42: ...GD82559ER Networking Silicon 36 Datasheet...
Page 70: ...GD82559ER Networking Silicon 64 Datasheet...
Page 78: ...GD82559ER Networking Silicon 72 Datasheet...