Intel Core i7 Extreme Edition, Datasheet

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Package Mechanical Specifications
34 Datasheet
3.2 Processor Component Keep-Out Zones
The processor may contain components on the substrate that define component keep-
out zone requirements. A thermal and mechanical solution design must not intrude into
the required keep-out zones. Decoupling capacitors are typically mounted to either the
topside or land-side of the package substrate. See
Figure 3-2 and Figure 3-3 for keep-
out zones. The location and quantity of package capacitors may change due to
manufacturing efficiencies but will remain within the component keep-in.
3.3 Package Loading Specifications
Table 3-1 provides dynamic and static load specifications for the processor package.
These mechanical maximum load limits should not be exceeded during heatsink
assembly, shipping conditions, or standard use condition. Also, any mechanical system
or component testing should not exceed the maximum limits. The processor package
substrate should not be used as a mechanical reference or load-bearing surface for
thermal and mechanical solution.
.
Notes:
1. These specifications apply to uniform compressive loading in a direction normal to the processor IHS.
2. This is the minimum and maximum static force that can be applied by the heatsink and retention solution
to maintain the heatsink and processor interface.
3. These specifications are based on limited testing for design characterization. Loading limits are for the
package only and do not include the limits of the processor socket.
4. Dynamic loading is defined as an 11 ms duration average load superimposed on the static load
requirement.
3.4 Package Handling Guidelines
Table 3-2 includes a list of guidelines on package handling in terms of recommended
maximum loading on the processor IHS relative to a fixed substrate. These package
handling loads may be experienced during heatsink removal.
3.5 Package Insertion Specifications
The processor can be inserted into and removed from an LGA1366 socket 15 times. The
socket should meet the LGA1366 requirements detailed in the appropriate processor
Thermal and Mechanical Design Guidelines (see
Section 1.2 )
Table 3-1. Processor Loading Specifications
Parameter Maximum Notes
Static Compressive Load 934 N [210 lbf] 1, 2, 3
Dynamic Compressive Load 1834 N [410 lbf] [max static
compr dynamic load]
1, 3, 4
Table 3-2. Package Handling Guidelines
Parameter Maximum Recommended Notes
Shear 70 lbs -
Tensile 25 lbs -
Torque 35 in.lbs -