Intel Core i7 Extreme Edition, Datasheet

Page: 31 / 102

Datasheet 31
Package Mechanical Specifications
3
Package Mechanical
Specifications
The processor is packaged in a Flip-Chip Land Grid Array package that interfaces with
the motherboard via an LGA1366 socket. The package consists of a processor mounted
on a substrate land-carrier. An integrated heat spreader (IHS) is attached to the
package substrate and core and serves as the mating surface for processor thermal
solutions, such as a heatsink.
Figure 3-1 shows a sketch of the processor package
components and how they are assembled together. Refer to the appropriate processor
Thermal and Mechanical Design Guidelines (see
Section 1.2 ) for complete details on
the LGA1366 socket.
The package components shown in Figure 3-1 include the following:
• Integrated Heat Spreader (IHS)
• Thermal Interface Material (TIM)
• Processor core (die)
• Package substrate
• Capacitors
Note:
1. Socket and motherboard are included for reference and are not part of processor package.
3.1 Package Mechanical Drawing
The package mechanical drawings are shown in Figure 3-2 and Figure 3-3 . The
drawings include dimensions necessary to design a thermal solution for the processor.
These dimensions include:
• Package reference with tolerances (total height, length, width, etc.)
• IHS parallelism and tilt
• Land dimensions
• Top-side and back-side component keep-out dimensions
• Reference datums
• All drawing dimensions are in mm.
• Guidelines on potential IHS flatness variation with socket load plate actuation and
installation of the cooling solution is available in the appropriate processor Thermal
and Mechanical Design Guidelines (see
Section 1.2 ).
Figure 3-1. Processor Package Assembly Sketch
IHS
Substrate
LGA1366 Socket
System Board
Capacitors
TIM
IHS
Substrate
LGA
System Board
Capacitors
Die
TIM