8
2.2
Features and Specifications
Table 2‑1 Features and Specifications
Manufacturing
Time
2021/4
Processor
Processor Type
The 3rd generation Intel® Xeon® scalable processors
(Up to 2 CPUs with TDP up to 270 W)
Socket
Two
Chipset
Chipset Type
C621A
Memory
Memory Type
RDIMMs, LRDIMMs, NVDIMMs (Barlow Pass)
Memory Slot Qty
32 (Refer to DIMM Replacement for DIMM population
and combination principles)
Total Memory
Capacity
Up to 4.0 TB (128 GB per memory module)
I/O Port
USB
2 rear USB 3.0 ports, 1 front USB 3.0 port and 1 front
USB 2.0 port
VGA
1 front VGA port
1 rear VGA port
Serial Port
1 rear serial port
UID LED
2 UID buttons with LEDs (1 front and 1 rear)
Display
Controller Type
Integrated in the Aspeed 2500 chip, up to 1280 × 1024
resolution
Backplane
Backplane
Hot-swap SAS/SATA/NVMe drives
NIC
NIC Controller
Standard OCP NIC 3.0 cards or standard PCIe cards and
onboard Intel X710 network supported on the
motherboard
Management
Management Chip
Integrated with 1 independent 1000 Mbps network
port, dedicated for IPMI remote management.
PCIe Expansion
Slot
3 onboard PCI Express Gen-Z 4.0 x16 slots and 1
PCI Express 4.0 x16 slot (16 lanes) for PCIe Riser
cards
The Riser card supports horizontal-inserted
full-height or half-height cards
8 PCIe Cards Configuration: Up to 3 Riser cards
(You can choose left 2 slot Riser or left 3 slot Riser)
