Application Note
9
Revision 1.0
2017-11-15
1200V HighSpeed 3 IGBT in TO-247PLUS Evaluation Board
User Manual
Usage
(a)
(b)
(c)
(d)
Figure 6
Assembling a device onto the heat sink and the PCB
3.1.2
Changing between 3pin and 4pin packages
Since the evaluation board has to serve as a universal test platform for TO-247-like packages with three
as well as four leads, it contains special five pin sockets which can accommodate all package variants.
The connection schemes for switches and drivers are described in Table 2.
1. Solder the discrete semiconductor package to the proper socket pins: four lead packages to pins 2-5,
three lead packages to pins 1-3.
2. Ensure that the reference of the driver output is connected to the proper Emitter lead using a 0
Ω
resistor: assemble R214/R224 for a three-pin, R213/R223 for a four pin configuration.
Table 2
Assembly of TO-247-like packages with three and four pins
Package
TO-247 4pin
TO-247PLUS 4pin
TO-247
TO-247PLUS
Connected
press fit pins
Pins 2-5
Pins 1-3
Reference of
driver output
Pin 3
(0Ω resistor at R2_4)
Pin 4
(0Ω resistor at R2_3)
Pin 3
(0Ω resistor at R2_4)
Pin 4
(0Ω resistor at R2_3)
Connection
Scheme
Picture
Comment
Operation of the
4pin package as a
3pin package
Intended operation
of the 4pin package
Intended operation
of the 3pin package
Attention:
floating
gate; setting can
cause device and
circuit destruction