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Demonstration System EPC9067

Table 2: Bill of Materials - Amplifier Board

Item

Qty Reference

Part Description

Manufacturer/Part Number

1

1

 C40

Capacitors, Ceramic, 4.7 µF, 10 V, ±20%, X5R

Samsung, CL05A475MP5NRNC

2

3

 C4, C5, C6

Capacitors, Ceramic, 1.0 µF, 100 V, ±10%, X7S 

TDK, C2012X7S2A105K125AB

3

3

 C95, C96, C97

Capacitors, Ceramic, 1.0 µF, 25 V, ±10%, X5R

Murata, GRM188R61E105KA12D

4

2

 C71, C72

Capacitors, Ceramic, 100 nF, 25 V, ±10%, X7R 

TDK, C1005X7R1E104K050BB 

5

2

 C41, C44

Capacitors, Ceramic, 100 nF, 16 V, ±10%, X7R 

Murata, GRM155R71C104KA88D

6

1

 C45

Capacitors, Ceramic, 22 nF, 25 V, ±10%, X7R 

TDK, C1005X7R1E223K050BB 

7

3

 C1, C2, C3

Capacitors, Ceramic, 10 nF, 100 V, ±20%, X7S 

TDK, C1005X7S2A103M050BB 

8

2

 C42, C43

Capacitors, Ceramic, 22 pF, 50 V, ±5%, NPO 

TDK, C1005C0G1H220J050BA

9

1

 R46

Resistors, 27 KΩ, ±1%, 1/10 W

Panasonic, ERJ-2RKF2702X

10

1

 R70

Resistors, 10.0 KΩ, ±1%, 1/10 W

Panasonic, ERJ-6ENF1002V 

11

1

 R74

Resistors, 191 Ω, ±1%, 1/10 W

Panasonic, ERJ-2RKF1910X

12

1

 R75

Resistors, 56 Ω, ±1%, 1/10 W

Panasonic, ERJ-2RKF56R0X

13

1

 R45

Resistors, 20 Ω, ±1%, 1/16 W

Stackpole, RMCF0402FT20R0

14

1

 R44

Resistors, 4.7 Ω, ±1%, ±/16 W 

Yageo, RC0402FR-074R7L

15

3

 D45, D74, D75

Diodes, Schottky Diode, 30 V, VF=370 mV @ 1 mA, 30 mA

Diodes Inc, SDM03U40-7 

16

1

 D40

Diodes, Schottky, 100 V, 0.2 A, VF=1 V @ 200 mA

ST Microelectronics, BAT41KFILM 

17

1

 D41

Diodes, Zener, 5.1 V, 150 mW ±5%

Bourns Inc., CD0603-Z5V1

18

1

 Q44

eGaN® FET, 100 V, 500 mA, R

DS(on) 

=2.1 Ω @ 50 mA, 5 V

EPC, EPC2038

19

2

 Q1, Q2

eGaN® FET, 65 V, 4.1A, R

DS(on) 

=138 mΩ @ 500 mA, 5 V

EPC, EPC8009

20

1

 U95

IC's, 5 V LDO, 250 mA, up to 16V

IN

, V

dropout

=0.33 V @ 250 mA

Microchip, MCP1703T-5002E/MC 

21

1

 U40

IC's, Gate driver, 5.2 VDC, 1.2 A, 4.5 V to 5.5 V

Texas Instruments, LM5113TME/NOPB 

22

1

 U72

IC's, Logic 2 NAND Gate, 1.65 V to 5.5 V, ± 24 mA 

Fairchild, NC7SZ00L6X 

23

1

 U71

IC's, 2 Input AND Gate, Tiny Logic, 1.65 V to 5.5 V, ± 32 mA 

Fairchild, NC7SZ08L6X 

24

4

 TP1, TP2, TP3, TP4

Test Point, Test Point Subminiature

Keystone, 5015

25

0.19

 J70, J90, GP1 (See Note 1)

Headers, Male Vertical, 36 Pin. 230" Contact Height, .1" Center Pitch

FCI, 68001-236HLF

26

4

 J1, J3, J4, J5

Headers, 2 Rows by 2 Pins .1" Male Vertical, .1" Center Pitch

TE Connectivity, 5-146256-2

Optional Components

Item

Qty Reference

Part Description

Manufacturer/Part Number

1

1

 C7

Capacitors, DNP, Ceramic, 1.0 µF, 100 V, ±10%, X7S 

TDK, C2012X7S2A105K125AB

2

1

 C46

Capacitor, DNP, Ceramic, 100 nF, 16 V, ±10%, X7R 

Murata, GRM155R71C104KA88D 

3

3

 R71, R72, R73

Resistor, DNP, 0 Ω, 1/10 W, Jumper

Panasonic, ERJ-3GEY0R00V 

4

2

 P74, P75

Potentiometer, DNP, Multi-turn Potentiometer, 1 kΩ, ±10%, 1/4 W, 12 Turn 

Top Adjustment Small

Murata, PV37W102C01B00

5

1

 Lbuck

Inductor, DNP, 10 μH, ±20%, 3.5 A, 33 mΩ, Resonance=40 MHz, Frequency 

Tested=100 KHz

Wϋrth, 744314101

6

1

 Lzvs

Inductor, DNP, 500 nH, , Q=180, 50 MHz, DCR=16.5 mΩ, I

RMS

=4.3 A

Coilcraft, 2929SQ-501JEB 

7

1

 D44

Diodes, DNP, Schottky Diode, 30 V, VF=370 mV @ 1 mA, 30 mA

Diodes Inc, SDM03U40-7 

8

1

 J2

Connector, DNP, RP-SMA Plug, 50 Ω

Linx, CONREVSMA013.062 

9

1

 HS1

Hardware, DNP, W= (0.590") 15 mm, by L= (0.590") 15 mm, H=(0.374")  

9.5 mm, 26.2°C/W @ 200 LFM

Advanced Thermal Solutions, ATS-54150D-C2-R0 

Note 1 (36 pin Header to be cut as follows) J70 cut 4 pins used, J90 cut 2 pins used, GP1 cut 1 pin used 

THERMAL CONSIDERATIONS

The EPC9067 development board showcases the EPC8009 eGaN FET. 
Although the electrical performance surpasses that for traditional 
Si devices, their relatively smaller size does magnify the thermal 
management requirements. The EPC9067 is intended for bench 
evaluation with low ambient temperature and convection cooling. 

The addition of heat-sinking and forced air cooling can significantly 
increase the current rating of these devices, but care must be taken to 
not exceed the absolute maximum die temperature of 125°C. 

NOTE. The EPC9067 development board does not have any current or thermal 
protection on board. 

Summary of Contents for EPC9067

Page 1: ...Development Board EPC9067 Quick Start Guide EPC8009 65VHalfBridgewithSyncFETBootstrapGateDrive ...

Page 2: ... Voltage Threshold Input High Input Low 3 5 0 6 1 5 V V Minimum High State Input Pulse Width VPWM rise and fall time 10ns 40 ns Minimum Low State Input Pulse Width VPWM rise and fall time 10ns 160 ns Assumesinductiveload maximumcurrentdependsondietemperature actualmaximumcurrent withbesubjecttoswitchingfrequency busvoltageandthermals Limitedbytimeneededto refresh highsidebootstrapsupplyvoltage QUI...

Page 3: ...CBypass Level shift PGND Gatedrive regulator Logicand dead time adjust VDD GND PWM LBuck COUT CZVS DC output LZVS HF output 7 5 12 VDC VIN supply notepolarity Highfrequency connection Switch node oscilloscope probe Groundpost Dead time setting if installed DC output measurement V Mainvoltage measurement V 52 VDCmax VMain supply notepolarity DC output Control signal inputs SMA optional Donot use pr...

Page 4: ... NC7SZ00L6X 23 1 U71 IC s 2 Input AND Gate Tiny Logic 1 65 V to 5 5 V 32 mA Fairchild NC7SZ08L6X 24 4 TP1 TP2 TP3 TP4 Test Point Test Point Subminiature Keystone 5015 25 0 19 J70 J90 GP1 See Note 1 Headers Male Vertical 36 Pin 230 Contact Height 1 Center Pitch FCI 68001 236HLF 26 4 J1 J3 J4 J5 Headers 2 Rows by 2 Pins 1 Male Vertical 1 Center Pitch TE Connectivity 5 146256 2 Optional Components It...

Page 5: ...TP1 1 TP2 Vmain Q1 GRret1 PGND PGND PGND PGND PGND PGND PGND GRH1 GLH1 Vmain Vmain Vmain Vmain Vmain 1 2 3 4 J70 PWM1 PWM2 DNP 1 2 R73 1 2 R72 PWM2 PWM2 PWM1 PWM1 DNP 0 Ω DNP 0 Ω 1 2 R71 PWM1 Q2 EPC8009 EPC8009 DNP Lbuck D40 BAT54 K FILM PGND C6 Vmain C5 PGND Vmain 5 V 4 7 V 4 7 V GLH1 PGND PGND C7 C40 HS1 DNP C2 C3 Output HF Gbtst Q44 EPC2038 100 V 2 8 Ω 1 2 R45 SDM03U40 D44 EMPTY C46 EMPTY D41 C...

Page 6: ...orcompliancewiththeEuropeanUniondirectiveonelectromagneticcompatibilityoranyothersuchdirectivesorregulations Asboard builds are at times subject to product availability it is possible that boards may contain components or assembly materials that are not RoHS compliant Efficient Power Conversion Corporation EPC makesnoguaranteethatthepurchasedboardis100 RoHScompliant TheEvaluationboard orkit isford...

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