QUICK START GUIDE
EPC – EFFICIENT POWER CONVERSION CORPORATION |
WWW.EPC-CO.COM
| COPYRIGHT 2017 | | 2
Demonstration System EPC9067
DESCRIPTION
The EPC9067 development board is a 65 V maximum device voltage,
2.7 A maximum output current, half bridge with onboard gate drives,
featuring the EPC8009 enhancement mode (eGaN®) field effect transistor
(FET). The gate driver has been configured with a synchronous FET
bootstrap circuit featuring the EPC2038 eGaN FET that eliminates high
side device losses induced by the reverse recovery losses of the internal
bootstrap diode of the gate driver. The purpose of this development
board is to simplify the evaluation process of the EPC8009 eGaN FET by
including all the critical components on a single board that can be easily
connected into any existing converter. The inclusion of the synchronous
FET bootstrap circuit enables significant increase in operating frequency
capability of the half bridge circuit.
The EPC9067 development board is 2” x 1.5” and has two EPC8009 eGaN
FETs in a half bridge configuration using Texas Instruments LM5113 gate
driver with supply and bypass capacitors. The board contains all critical
components and layout for optimal switching performance. There are
also various probe points to facilitate simple waveform measurement
and efficiency calculation. The board includes pads for the inclusion of
customer components to facilitate testing in a Buck converter or ZVS
class-D amplifier configurations. A complete block diagram of the circuit
is given in figure 1.
For more information on the EPC8009 and EPC2038 eGaN FETs please
refer to the datasheet available from EPC at
www.epc-co.com
. The
datasheet should be read in conjunction with this quick start guide.
Table 1: Performance Summary (T
A
= 25°C) EPC9067
Symbol
Parameter
Conditions
Min
Max Units
V
DD
Gate Drive Input Supply
Range
7.5
12
V
V
IN
Bus Input Voltage Range
52*
V
V
OUT
Switch Node Output Voltage
65
V
I
OUT
Switch Node Output Current
2.7*
A
V
PWM
PWM Logic Input Voltage
Threshold
Input ‘High’
Input ‘Low’
3.5
0
6
1.5
V
V
Minimum ‘High’ State Input
Pulse Width
V
PWM
rise and
fall time < 10ns
40
ns
Minimum ‘Low’ State Input
Pulse Width
V
PWM
rise and
fall time < 10ns 160
#
ns
*Assumes inductive load, maximum current depends on die temperature – actual maximum current
with be subject to switching frequency, bus voltage and thermals.
# Limited by time needed to ‘refresh’ high side bootstrap supply voltage.
QUICK START PROCEDURE
Development board EPC9067 is easy to set up to evaluate the performance
of the EPC8009 eGaN FET. Refer to figure 2 for proper connect and
measurement setup and follow the procedure below:
1. Configure the board for either ZVS class-D operation OR Buck converter
operation.
2. With power off, connect the input power supply bus to +V
IN
(J1) and
ground / return to –V
IN
(J4).
3. For ZVS class-D operation, with power off, connect a HF load to the HF
output (RF-J2 OR Vsw-J3 and GND-J4). For Buck converter operation,
with power off, connect a DC load to the DC output (+V
OUT
-J5 and
GND-J4).
4. With power off, connect the gate drive input to +V
DD
(J90, Pin-1) and
ground return to –V
DD
(J90, Pin-2).
5. With power off, connect the input PWM control signal to PWM (J70,
Pin-1) and ground return to either Pin-2 or Pin-4 of J70.
6. Turn on the gate drive supply – make sure the supply is within the
7.5 V and 12 V range.
7. Turn on the controller / PWM input source and probe switching node to
observe switching operation.
8. Turn on the bus voltage to the required value (do not exceed the
absolute maximum voltage of 52 V on V
OUT
). Increase voltage slowly
while monitoring operation to ensure the FETs are operating within
their datasheet parameters.
9. Once operational, adjust the bus voltage and load PWM control
within the operating range and observe the output switching
behavior, efficiency and other parameters.
10. For shutdown, please follow steps in reverse.
NOTE.
When measuring the high frequency content switch node, care
must be taken to avoid long ground leads. Measure the switch node by
placing the oscilloscope probe tip through the large via on the switch
node (designed for this purpose) and grounding the probe directly
across the GND terminal provided. See figure 3 for proper scope probe
technique.
EPC9067 development board