IEI Technology WAFER-EHL Series, User Manual

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WAFER-EHL SBC
Page 54
Step 4: Press the M.2 module down until it is secured into place by the retainer. (See
Figure 4-5 )
Figure 4-5: Securing the M.2 Module
Step 5: If you want to remove the M.2 module, you should press the retainer down as
described in Step 1 to release the M.2 module.. (See Figure 4-3 )
4.4 Chassis Installation
4.4.1 Heat Spreader
WARNING:
The heat spreader installed on the WAFER-EHL can only serve as a heat
conductor, which needs additional heat dissipation mechanism to achieve
suitable thermal condition. DO NOT put the WAFER-EHL with the heat spreader
directly on a surface that cannot dissipate system heat, and never run the
WAFER-EHL without the heat spreader secured to the board.
When the WAFER-EHL is shipped, it is secured to a heat spreader with five retention
screws. The heat spreader must have a direct contact with a heat dissipation surface to
ensure stable operation. In addition, a thin layer of thermal paste has to be applied onto
the heat dissipation surface where it contacts the heat spreader.