13. Electrical and Signal Characteristics
384
PowerSpan II User Manual
80A1010_MA001_09
Integrated Device Technology
www.idt.com
13.3
Operating Conditions
13.3.1
Recommended Operating Conditions
The following table,
, specifies the recommended operating conditions of the PowerSpan II.
13.3.2
Handling and Storage Specifications
After encapsulation, cure cavity down assemblies are JESD22-A112 Moisture Sensitivity Category 3.
From that point on, parts are to be handled to the following criteria:
1.
From encapsulation cure to BGA/PGA attach, Class 3 modules can be exposed for a maximum
cumulative time of eight days to an environment of no more than 30 OC and/or 60% RH. If this
condition is exceeded, modules are to be baked at
125 O C +/- 10 OC for 24 hours minimum or at other qualified bake parameters.
2.
Modules shall be placed in an ESD carrier. Each module shall be orientated in the same way. When
preparing for shipment to stock location, modules are to be baked at 125 O C +/- 10 O C for 24
hours minimum or at other qualified bake parameters. Modules are to be sealed within 24 hours for
Class 3 modules in a moisture barrier ESD bag with desiccant. This bakeout procedure can be
repeated once to remain in compliance.
3.
Failure to comply with this requirement can result in die to die pad, encapsulant to soldermask or
encapsulant to die delamination during reflow.
Table 89: Operating and Storage Conditions
Symbol
Parameter
Min
Max
Units
Vdd I/O
I/O DC Supply
Voltage
3.15
3.45
V
Vdd Core
Core Supply
Voltage
2.38
2.63
V
Px_VDDA
PLL Supply Voltage
2.38
2.63
V
Ta
Ambient
Temperature
-40
+85
°C
H
Humidity
0
80
% Relative
Humidity