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HUAWEI MU739 HSPA+ LGA Module

Hardware Guide

About This Document

Issue 01 (2011-08-24)

Huawei Proprietary and Confidential

About This Document

History

Version

Date

Chapter Descriptions

01(Draft1) 2011-06-24

Creation

01(Draft2) 2011-08-24

Updated

draft2

Summary of Contents for MU739

Page 1: ...HUAWEI MU739 HSPA LGA Module Hardware Guide Issue 01 Date 2011 08 24 d r a f t 2 ...

Page 2: ... product service and company names mentioned are the property of their respective owners Notice Some features of the product and its accessories described herein rely on the software installed capacities and settings of local network and may not be activated or may be limited by local network operators or network service providers thus the descriptions herein may not exactly match the product or i...

Page 3: ...bout This Document Issue 01 2011 08 24 Huawei Proprietary and Confidential Copyright Huawei Technologies Co Ltd 3 About This Document History Version Date Chapter Descriptions 01 Draft1 2011 06 24 Creation 01 Draft2 2011 08 24 Updated d r a f t 2 ...

Page 4: ...k Diagram of the product 3 Description of the Application Interfaces Describes the external application interfaces of the product 4 RF Specifications Describes the RF specifications of the product 5 Electrical and Reliability Features Describes the electrical and reliability features of the interfaces in the product 6 Mechanical Specifications Describes the Dimension Label and Packing System of th...

Page 5: ...rview 20 3 3 2 VBAT Interface 20 3 3 3 Output Power Supply Interface 21 3 4 Signal Control Interface 21 3 4 1 Overview 21 3 4 2 Input Signal Control Pins 23 3 4 3 Output Signal Control Pins 26 3 5 USB Interface 29 3 6 USIM Card Interface 30 3 6 1 Overview 30 3 6 2 Circuit Recommended for the USIM Card Interface 31 3 6 3 ESD Protection for the USIM Card Interface 33 3 7 Audio Interface 33 3 8 IPC I...

Page 6: ...trical and Reliability Features 47 5 1 About This Chapter 47 5 2 Absolute maximum ratings 47 5 3 Operating and Storage Temperatures and Humidity 48 5 4 Electrical Features of Application Interfaces 48 5 5 Power Supply Features 51 5 5 1 Input Power Supply 51 5 5 2 Power Consumption 51 5 6 Reliability Features 55 5 7 EMC and ESD Features 56 6 Mechanical Specifications 58 6 1 About This Chapter 58 6 ...

Page 7: ... 5 3 Overall System Certification 78 8 Safety Information 82 8 1 Interference 82 8 2 Medical Device 82 8 3 Area with Inflammables and Explosives 82 8 4 Traffic Security 83 8 5 Airline Security 83 8 6 Safety of Children 83 8 7 Environment Protection 83 8 8 WEEE Approval 83 8 9 RoHS Approval 83 8 10 Laws and Regulations Observance 84 8 11 Care and Maintenance 84 8 12 Emergency Call 84 8 13 Specific ...

Page 8: ...are provided when the HUAWEI MU739 HSPA LGA Module hereinafter referred to as the MU739 module is used This document helps you to understand the interface specifications electrical features and related product information of the MU739 module MU739 module is related to the following products Product name Description MU739 WCDMA HSDPA HSUPA HSPA 850 MHz 900 MHz 1700 MHz AWS 1900 MHz 2100 MHz GSM GPR...

Page 9: ...ble 2 1 Features Feature Description Physical Features Dimensions L W H 20 mm 30 mm 2 0mm NOTE the final vesion will be 2 0mm height the existing samples provided may be 2 2mm height Weight less than 3 1 g Operating Bands WCDMA HSDPA HSUPA HSPA 850 MHz 900 MHz 1700 MHz AWS 1900 MHz 2100 MHz GSM GPRS EDGE 850 MHz 900 MHz 1800 MHz 1900 MHz Operating Temperature Normal working temperature 10 C 55 C E...

Page 10: ...receiving and text message sending Management of text messages read messages delete messages storage status and message list Supporting MO and MT Point to point and cell broadcast Supporting formats of TEXT and PDU Data Services GSM CS UL 14 4 kbps DL 14 4 kbps GPRS UL 85 6 kbps DL 85 6 kbps EDGE DL 236 8 kbps UL 236 8 kbps WCDMA CS UL 64 kbps DL 64 kbps WCDMA PS UL 384 kbps DL 384 kbps HSPA UL 5 ...

Page 11: ...ircuit Block Diagram Figure 2 1 shows the circuit block diagram of the MU739 module The application block diagram and major functional units of the MU739 module contain the following parts Baseband controller Power manager Multi chip package MCP memory Radio frequency RF transceiver RF interface RF PA Figure 2 1 Circuit block diagram of the MU739 module d r a f t 2 ...

Page 12: ...iagram Figure 2 2 Application block diagram of the MU739 module USB Interface The USB interface supports USB 2 0 high speed standard USIM Interface The USIM interface provides the interface for a USIM card The USIM card can be inserted into the host side Power Supply DC 3 8V is recommended Audio Interface The module supports one I2S interface RF Pad RF antenna interface d r a f t 2 ...

Page 13: ...scribes the external application interfaces of the MU739 module including LGA Interface Power Interface Signal Control Interface USB Interface USIM Card Interface Audio Interface IPC Interface General Purpose I O Interface JTAG Interface RF Antenna Interface Reserved Interface NC Interfaces 3 2 LGA Interface The MU739 module uses a 114 pin LGA as its external interface For details about the module...

Page 14: ...ions of pins on the 114 pin signal interface of the MU739 module 78 77 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 114 113 112 111 110 109 108 107 106 105 104 103 102 101 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 76 58 59 60 61 62 63 64 65 66 67 68 69 70 71...

Page 15: ... 2 1 9 RESOUT_N O Reset output 0 3 1 8 2 1 10 JTAG_TMS I JTAG State machine control signal 0 3 1 8 2 1 11 JTAG_TDI I JTAG Serial Data Input 0 3 1 8 2 1 12 JTAG_TCK I JTAG clock input 0 3 1 8 2 1 13 ON1 I Turn on the module high active 0 3 1 8 2 1 14 HSIC_HOST_ACTIVE I HSIC Host Active Inactive the host controller is switched off Active the host controller is switched on Used to synchronize enumera...

Page 16: ...ock 0 1 8 2 9 2 1 3 3 28 MIPI_HSI_RX_FLG I MIPI HS Receive Flag 0 54 1 8 2 1 29 SIM_DATA I O USIM Data Input Output 0 1 8 2 9 2 1 3 3 30 MIPI_HSI_RX_RDY O MIPI HS Receive Ready 0 54 1 8 2 1 31 PWRDWN_N I Put the complete system baseband PMU and RF into an initial state 1 8 32 USB_VBUS P Power supply for USB 3 3 5 33 MIPI_HSI_TX_RDY I MIPI HS Transmit Ready 0 54 1 8 2 1 34 MIPI_HSI_TX_WAKE I MIPI H...

Page 17: ... Pin for network mode LED 0 3 1 8 2 1 47 Reserved Reserve 48 ON2_N I Turn on the module low active 0 3 1 8 2 1 49 VBAT_PMU P Battery supply power supply for Baseband and Transceiver 3 3 3 8 4 2 50 Reserved Reserve 51 VBAT_PA P Battery supply power supply for PA 3 3 3 8 4 2 52 VBAT_PA P Battery supply power supply for PA 3 3 3 8 4 2 53 RESIN_N I Baseband reset 0 3 1 8 2 1 54 I2S_CLK1 O Serial clock...

Page 18: ...nd 0 65 MAIN_ANT Main antenna 66 GND Ground 0 67 GND Ground 0 68 GND Ground 0 69 NC No connect 70 GND Ground 0 71 GND Ground 0 72 AUX_ANT Diversity antenna 73 GND Ground 0 74 GND Ground 0 75 NC No connect 76 NC No connect 77 NC No connect 78 NC No connect 79 GND Ground 0 80 GND Ground 0 81 GND Ground 0 82 GND Ground 0 83 GND Ground 0 84 GND Ground 0 85 GND Ground 0 86 GND Ground 0 87 GND Ground 0 ...

Page 19: ...d 0 100 GND Ground 0 101 GND Ground 0 102 GND Ground 0 103 GND Ground 0 104 GND Ground 0 105 GND Ground 0 106 GND Ground 0 107 GND Ground 0 108 GND Ground 0 109 GND Ground 0 110 GND Ground 0 111 GND Ground 0 112 GND Ground 0 113 GND Ground 0 114 GND Ground 0 P indicates power pins I indicates pins for digital signal input O indicates pins for digital signal output The NC No Connect pins are intern...

Page 20: ...aseband and Transceiver 3 3 3 8 4 2 51 52 VBAT_PA P Battery supply power supply for PA 3 3 3 8 4 2 20 SIM_VCC P Power supply for USIM card 1 8 2 9 32 USB_VBUS P Power supply for USB 3 3 5 38 VCC_EXT1 P 1 8 V power output 1 7 1 8 1 9 40 VCC _IN P 1 8 V power input 1 8 62 64 66 68 70 71 73 74 79 114 GND Ground 0 3 3 2 VBAT Interface When the MU739 module works normally power is supplied through the ...

Page 21: ...MI performance FC FBMJ1608HS280NT manufactured by TAIYO YUDEN or MPZ1608S300ATAH0 manufactured by TDK is recommended Figure 3 2 shows the recommended power circuit of MU739 module Figure 3 2 Recommended power circuit of MU739 module 3 3 3 Output Power Supply Interface Output power supply Interfaces are SIM_VCC VCC_EXT1 Through the SIM_VCC power supply interface the MU739 module can supply 1 8 V an...

Page 22: ...high active 0 3 1 8 2 1 48 ON2_N I Turn on the module low active 0 3 1 8 2 1 9 RESOUT_N O Reset output 0 3 1 8 2 1 31 PWRDWN_N I Put the complete system baseband PMU and RF into an initial state 1 8 53 RESIN_N I Baseband reset 0 3 1 8 2 1 39 W_DISABLE_N I Airplane mode 0 3 1 8 2 1 45 LED_STATUS O Pin for network status LED 0 3 1 8 2 1 46 LED_MODE O Pin for network mode LED 0 3 1 8 2 1 42 WAKEUP_IN...

Page 23: ...ied to GND this input can be used to force an automatic boot up when power is applied or after a hard reset is performed Figure 3 3 Connections of ON1 and ON2_N pins The PWRDWN_N pin is used to power down the module When the software stops responding the PWRDWN_N pin can be pulled down for at least 20 ms to reset the complete system baseband PMU and RF into initial state Active low with internal p...

Page 24: ...at the circuit length not exceed 20 mm and that the circuit be kept at a distance of 2 54 mm 100 mil at least from the PCB edge Furthermore you need to wrap the area adjacent to the signal wire with a ground wire Otherwise the module may be reset due to interference Figure 3 4 Connections of RESIN_N and PWRDWN_N pins Power On Time Sequence After VBAT_PMU has been applied and is stable the module w...

Page 25: ...W_DISABLE_N Low active signal When W_DISABLE_N Is low asserted the RF will be turned OFF When W_DISABLE_N is high de asserted the RF will be turned ON Figure 3 6 W_DISABLE_N timing PWRDWN_N The PWRDWN_N pin is used to reset the system If the software of the MU739 module fails responding you can reset the hardware through the PWRDWN_N signal as shown in Figure 3 7 When a low level pulse is supplied...

Page 26: ...Signal Control Pins The MU739 module provides two LED controlling signals LED_STATUS and LED_MODE Different blinking modes of the status LED indicate different network status Table 3 5 describes the status of the LED_STATUS pin and LED_MODE pin Table 3 5 List of the LED_STATUS pin and LED_MODE pin No Operating Status LED_STATUS LED_MODE 1 The 3G network is successfully registered The indicator bli...

Page 27: ...each time Blinking Fast Figure 3 9 Status when the indictor blinks fast Blinking Twice Each Time Figure 3 10 Status when the indictor blinks twice each time External Circuits Figure 3 11 shows the recommended circuits of the LED_MODE and LED_STATUS pins According to LED feature you can adjust the LED brightness by adjusting the impedance of resistor 100 ms Light off Light on 1 cycle 200 ms 100 ms ...

Page 28: ... 11 Driving circuit The brightness of the LED depends on the current value and for most of the indicator lights the current from 2 mA to 5 mA is already enough Figure 3 12 LED Typical Electro Optical Characteristics Curves SLEEP_STATUS Signal The SLEEP_STATUS signal is used to indicate the status of MU739 The AP can get to know the module is in sleep or not by reading this pin d r a f t 2 ...

Page 29: ...t the external memory MCP Once system powers on the RESOUT_N signal can be routed to the AP processor to allow the AP to monitor and detect resets of the modem system During reset this signal is an output logic low RESOUT_N would be monitored by a host processor GPIO with internal pull up 3 5 USB Interface The MU739 is compliant with USB 2 0 high speed protocol The USB interface is powered from th...

Page 30: ...ecification 2 0 Figure 3 14 Recommended circuit of USB interface The layout design of this circuit on the AP board should comply with the USB 2 0 high speed protocol with differential lining and impedance control to 90 ohm It is recommended that set USB_DP and USB_DM pins as test points and then place these test points on the AP for debug You don t need to connect the USB_VBUS when the function of...

Page 31: ..._DATA I O External USIM data signal 0 1 8 2 9 2 1 3 3 3 6 2 Circuit Recommended for the USIM Card Interface As the MU739 module is not equipped with a USIM card socket you need to place a USIM card socket on the user interface board The USIM card signals are transmitted outwards through the 114 pin LGA interface Figure 3 15 shows the circuit of the USIM card interface There is no pull up on SIM_DA...

Page 32: ...se a long circuit may lead to wave distortion thus affecting signal quality It is recommended that you wrap the area adjacent to the SIM_CLK and SIM_DATA signal wires with a ground wire The GND pin of the USIM card socket and the GND pin of the USIM card must be well connected to the power GND pin supplying power to the MU739 module A 100 nF capacitor 0402 package is recommended so that larger cap...

Page 33: ...hat supplies power to the MU739 module Figure 3 17 ESD protection circuit on the USIM card 3 7 Audio Interface I2S features Two supported modes Normal mode and PCM mode 32 bit data path Interface can operate in master and slave mode Two independent 64 word data buffers for receiver and transmitter Bi directional transmission with independent receiver and transmitter Two independent fractional divi...

Page 34: ...e contact us for more details about this information 3 8 IPC Interface The IPC Inter Processor Communications interface includes HSIC interface and MIPI_HSI interface The MU739 module has reserved IPC interface in hardware but the software couldn t support this function right now If you need please contact us for more details about this information 3 8 1 HSIC interface HSIC uses 2 signals strobe d...

Page 35: ... be switched to L2 because MU739 has no data to transfer 0 3 1 8 2 1 41 HSIC_HOST_ WAKEUP O Used by MU739 to resume link from L2 or L3 to L0 when data is available on MU739 0 3 1 8 2 1 44 HSIC_SUSPEND_ REQUEST O Used by CP in L0 to indicate that link can be switched to L2 because CP has no data to transfer 0 3 1 8 2 1 HSIC interface is mainly used signal transfer between the IC on the board decrea...

Page 36: ...4 MIPI_HSI_TX_WAKE I MIPI HS Transmit Wake 0 54 1 8 2 1 35 MIPI_HSI_TX_FLG O MIPI HS Transmit Flag 0 54 1 8 2 1 36 MIPI_HSI_TX_DATA O MIPI HS Transmit Data 0 54 1 8 2 1 37 MIPI_HSI_RX_WAKE I MIPI HS Receive Wake 0 54 1 8 2 1 3 9 General Purpose I O Interface The LGA module provides 2 GPIO pins for customers to use controlling signals which are worked at 1 8 V CMOS logic levels Customers can use AT...

Page 37: ... 1 8 JTAG_TRST_N O JTAG Reset Module enable 0 3 1 8 2 1 10 JTAG_TMS I JTAG State machine control signal 0 3 1 8 2 1 11 JTAG_TDI I JTAG Serial Data Input 0 3 1 8 2 1 12 JTAG_TCK I JTAG clock input 0 3 1 8 2 1 It is suggested that place the above 5 test points on the AP board for debug 3 11 RF Antenna Interface MU739 module provides 2 antenna interfaces for connecting the external antennas Table 3 1...

Page 38: ...ei Proprietary and Confidential Copyright Huawei Technologies Co Ltd 38 3 13 NC Interfaces The MU739 module has 12 NC pins All of NC interfaces should not be connected Please keep these pins open Table 3 16 List of NC pins Pin No Pin Name I O Description 1 3 4 5 7 60 61 69 75 76 77 78 NC No connect d r a f t 2 ...

Page 39: ...tenna in a place covered by the signal The Antenna must be installed to provide a separation distance of at least 20cm from all persons and must not be co located or operating in conjunction with any other antenna or transmitter Antenna must not be installed inside metal cases Antenna must be installed also according Antenna manufacturer instructions 4 3 Operating Frequencies Table 4 1 shows the R...

Page 40: ...s relates to the cable and the test environment The instrument compensation needs to be set according to the actual cable conditions 4 4 2 Test Standards Huawei modules meet all 3GPP test standards relating to both 2G and 3G Each module passes strict tests at the factory and thus the quality of the modules is guaranteed 4 5 Conducted Rx Sensitivity and Tx Power 4 5 1 Conducted Receive Sensitivity ...

Page 41: ...05 101 Band I BER 0 1 106 7 110 5 108 Band II BER 0 1 104 7 110 108 Band IV BER 0 1 106 7 110 5 108 Band VIII BER 0 1 103 7 109 5 108 Band V BER 0 1 104 7 110 5 108 The test values are the average of some test samples 4 5 2 Conducted Transmit Power The conducted transmit power is another indicator that measures the performance of MU739 The conducted transmit power refers to the maximum power that ...

Page 42: ...na Design Indicators Antenna Efficiency Antenna efficiency is the ratio of the input power to the radiated or received power of an antenna The radiated power of an antenna is always lower than the input power due to the following antenna losses return loss material loss and coupling loss The efficiency of an antenna relates to its electrical dimensions To be specific the antenna efficiency increas...

Page 43: ...nd φ but is independent of the radial coordinates The radiation pattern of half wave dipole antennas is omnidirectional in the horizontal plane and the incident waves of base stations are often in the horizontal plane For this reason the receiving performance is optimal The following radiation patterns are recommended for the antenna of MU739 Master antenna omnidirectional Gain and Directivity The...

Page 44: ...ance shield the LCD interference signals shield the signal cable of the board or design filter circuits Huawei is able to make technical suggestions on radio performance improvement of the module 4 6 3 GSM WCDMA Antenna Requirements The antenna for MU739 must fulfill the following requirements GSM WCDMA Antenna Requirements Frequency range Depending on frequency band s provided by the network oper...

Page 45: ...or mobile and fixed operating configurations 4 6 4 Radio Test Environment The antenna efficiency antenna gain radiation pattern total radiated power TRP and TIS can be tested in a microwave testing chamber Huawei has a complete set of OTA test environments SATIMO microwave testing chambers and ETS microwave testing chambers The testing chambers are certified by professional organizations and are a...

Page 46: ... MU739 HSPA LGA Module Hardware Guide RF Specifications Issue 01 2011 08 24 Huawei Proprietary and Confidential Copyright Huawei Technologies Co Ltd 46 Figure 4 1 SATIMO microwave testing chamber d r a f t 2 ...

Page 47: ...ute maximum ratings Operating and Storage Temperatures and Humidity Electrical Features of Application Interfaces Power Supply Features Reliability Features EMC and ESD Features 5 2 Absolute maximum ratings Table 5 1 lists the absolute maximum ratings for the MU739 module Using the MU739 module beyond these conditions may result in permanent damage to the module Table 5 1 Absolute maximum ratings ...

Page 48: ...ure for storage 40 85 C Moisture 5 95 1 When the MU739 module works at this temperature all its RF indexes comply with the 3GPP TS 45 005 specifications 2 When the MU739 module works at this temperature certain RF indexes do not comply with the 3GPP TS 45 005 specifications 5 4 Electrical Features of Application Interfaces Table 5 3 Electrical features of Digital Pins in the I O Supply Domain VDDP...

Page 49: ... Pins in the I O supply domain of the UUSIM Interface Parameter Description Minimum Value Maximum Value Note Unit VIH High level input voltage 0 7 x VDDP_USIM 3 3 VDDP_USIM 1 8 2 9V V VIL Low level input voltage 0 0 2 VDDP_USIM VDDP_USIM 1 8 2 9V V VIH High level input voltage 0 7 x VDDP_USIM 3 3 VDDP_USIM 1 8 2 9V IOL 1 0 mA V VIL Low level input voltage 0 0 2 VDDP_USIM VDDP_USIM 1 8 2 9V IOL 1 0...

Page 50: ...e 5 7 Electrical features of Digital Pins in the I O supply domain of the MIPI HSI Interface Parameter Description Minimum Value Maximum Value Note Unit VIH High level input voltage 0 7 VDD_MIPI VDD_MIPI 0 3 VDD_MIPI 1 2 V 1 8 V V VIL Low level input voltage 0 3 VDD_MIPI 0 35 VDD_MIPI VDD_MIPI 1 2 V 1 8 V V VOH High level output voltage VDD_MIPI 0 1 VDD_MIPI 1 2 V IOL 100 μA V VOL Low level output...

Page 51: ... 5 1 Power Supply During Burst Emission The VBAT Minimum Value must be guaranteed during the burst with 2 75 A Peak in GSM GPRS or EGPRS mode Table 5 9 Requirements for input current of the MU739 module Power Peak Maximum Normal Maximum 3 8 V 2750 mA 1100 mA 5 5 2 Power Consumption The power consumptions of MU739 in different scenarios are respectively listed in Table 5 10 Table 5 11 and Table 5 1...

Page 52: ...UMTS bands 50 mA Module power up and idle DRX cycle 8 2 56 s GSM GPRS EDGE GSM bands 60 mA Module power up and idle MFRMS 5 1 175 s Table 5 11 DC power consumption HSPA WCDMA Description Band Test Value Units Power dBm WCDMA Band I IMT2100 175 mA 1 dBm Tx Power 215 10 dBm Tx Power 570 24 dBm Tx Power Band II PCS 1900 175 mA 1 dBm Tx Power 220 10 dBm Tx Power 640 24 dBm Tx Power Band IV AWS 170 mA ...

Page 53: ...Bm Tx Power Band V 850 MHz 185 mA 1 dBm Tx Power 220 10 dBm Tx Power 540 24 dBm Tx Power Band VIII 900 MHz 185 mA 1 dBm Tx Power 225 10 dBm Tx Power 580 24 dBm Tx Power Table 5 12 DC power consumption GSM GPRS EDGE Description Test Value Units PCL Configuration GPRS850 230 mA 5 1 Up 1 Down 395 2 Up 1 Down 600 4 Up 1 Down 95 mA 10 1 Up 1 Down 125 2 Up 1 Down 165 4 Up 1 Down GPRS900 225 mA 5 1 Up 1 ...

Page 54: ...1 Down 360 4 Up 1 Down 90 mA 10 1 Up 1 Down 110 2 Up 1 Down 145 4 Up 1 Down EDGE850 175 mA 8 1 Up 1 Down 285 2 Up 1 Down 430 4 Up 1 Down 120 mA 15 1 Up 1 Down 175 2 Up 1 Down 270 4 Up 1 Down EDGE900 175 mA 8 1 Up 1 Down 280 2 Up 1 Down 420 4 Up 1 Down 120 mA 15 1 Up 1 Down 175 2 Up 1 Down 265 4 Up 1 Down EDGE1800 160 mA 2 1 Up 1 Down 260 2 Up 1 Down 400 4 Up 1 Down 110 mA 10 1 Up 1 Down 155 2 Up 1...

Page 55: ...ty of the MU739 module Table 5 13 Test conditions and results of the mechanical reliability of the MU739 module Item Test Condition Standard Low temperature storage Temperature 40ºC 2ºC Test duration 24 h IEC60068 High temperature storage Temperature 85ºC 2ºC Test duration 24 h IEC60068 Low temperature working Temperature 30ºC 2ºC Test duration 24 h IEC60068 High temperature working Temperature 75...

Page 56: ...direction IEC60068 Clash test Half sine wave Peak acceleration 180 m s2 Pulse duration 6 ms Repetition time 6 directions 1000 times for each direction IEC60068 Drop test First case 0 3 m in height Drop the MU739 module on the marble terrace with one surface facing downwards twice Six surfaces should be tested Second case 0 8 m in height Drop the MU739 module on the marble terrace with one surface ...

Page 57: ...of the USIM interface lines preferably 10 cm EMC protection on audio input output filters against 900MHz emissions Biasing of the microphone inputs Ground plane HUAWEI Wireless recommends a common ground plane for analog digital RF grounds A metallic case or plastic casing with conductive paint is recommended except for the area around the antenna The HUAWEI MU739 Module does not include any prote...

Page 58: ... 6 Mechanical Specifications 6 1 About This Chapter This chapter describes the following aspects of the MU739 module Dimensions and Interfaces Customer PCB Pad Design Label Packing System 6 2 Dimensions and Interfaces Figure 6 1 shows the dimensions of MU739 in details The final version will be with 0 6mm PCB but the temperory samples are with 0 8mm PCB d r a f t 2 ...

Page 59: ...etary and Confidential Copyright Huawei Technologies Co Ltd 59 Figure 6 1 Dimensions of MU739 label PIN1 X Y 18 50 16 00 13 75 28 30 23 75 22 50 1 25 4 50 1 00 2 75 4x 1 0 4x 1 2 35x 2 0 35x 3 0 34x 0 6 34x 1 0 2 0 3 0 2 54 45 0 40x 0 9 40x 0 76 B C D E A B 5 1 C 5 1 D 5 1 E 5 1 A 5 1 Unit mm d r a f t 2 ...

Page 60: ... To achieve assembly yields and solder joints of high reliability it is recommended that the customer PCB pad sizes be designed as the same as MU739 s LGA pads For details see Figure 6 2 Figure 6 2 PCB pad design 6 4 Label The label is made from deformation resistant fade resistant and high temperature resistant material and is able to endure the high temperature of 260 C Unit mm d r a f t 2 ...

Page 61: ...nd surface finishing and coatings which used have to make satisfied with the EU WEEE and RoHS directives The label must be heated up for 20 s 40 s and able to endure the high temperature of 260 C And the color of the material of the nameplate can t change 6 5 Packing System HUAWEI LGA module uses five layers ESD pallet anti vibration foam and vacuum packing into cartons To get the details about th...

Page 62: ...ions Certifications Environmental Protection Certification and Test National Compulsory Certification GCF and PTCRB 7 2 Certifications The certification of MU739 has not carried out Table 7 1 shows certifications the MU739 will be implemented For more demands please contact us for more details about this information Table 7 1 Product Certifications Certification Model name MU739 CE number FCC numb...

Page 63: ...ity Restricted Substance Density Threshold ppm Cadmium Cd 100 Lead Pb 1000 Mercury Hg 1000 Hexavalent chromium Cr6 1000 Polybrominated biphenyls PBB 1000 Polybrominated diphenyl ether PBDE 1000 Declaration of Conformity DOC The product is declared as environment friendly or as compliant with the environmental protection requirements after internal testing 7 3 2 WEEE WEEE stands for the Waste Elect...

Page 64: ...duce soft plastic products such as artificial leather membrane and cable sheaths and hard plastic products such as plates windows doors pipes and valves PVC free test mainly applies to printed circuit boards PCBs and surface mount technology SMT components A notified body must perform PVC free tests qualitative analysis and mixed tests and then issue relevant test reports 7 3 4 Packaging The packa...

Page 65: ...deral Communications Commission FCC mark in U S A and China Compulsory Certificate CCC mark are compulsory certification marks Only the products with required compulsory certification marks can be sold in the relevant countries or regions Non compulsory certification Non compulsory certification is also called voluntary certification Compared with compulsory certification marks the certification m...

Page 66: ...most cases 7 4 6 Certification Types CE Certification According to the R TTE Directive 1999 95 EC all wireless equipment and telecommunications terminals sold in EU must meet all the stipulated health safety RF and EMC requirements that provide for CE mark Wireless equipment using frequency bands whose use is not harmonized throughout the EU should pass the certification test of a notified body No...

Page 67: ...er Huawei QIS YYYYYYY is the product number consisting of two to 14 digits An FCCID consists of capital letters in English digits and symbols only No other character is allowed For any Huawei product the product model is used as the product number For example the FCC ID of the EM770W is QISEM770W NCC DGT Certification According to Telecommunications Act and Regulations on Inspection and Certificat...

Page 68: ...mark produced by the Australian Communications and Media Authority ACMA for telecommunications equipment The A Tick indicates that a product is compliant with the mandatory technical and safety standards specified by ACMA and can legally be connected to a telecommunications network in Australia All A Tick certification test items should be performed in local labs in Australia The test items are as...

Page 69: ...ry for telecommunications equipment in Japan according to the Telecommunications Business Law As specified in article 68 in the Telecommunications Business Law enforced in 1985 the Ministry of Public Management Home Affairs Posts and Telecommunications MPHPT has the right to designate qualified agencies for technical certification The MPHPT designates the Japan Approvals Institute for Telecommunic...

Page 70: ...e IC certification or registration number is as follows IC XXXXXX YYYYYYYY XXXXXX XXXXXX is the company number issued by the IC Huawei 6369A YYYYYYYY YYYYYYYY is the unique product number UPN consisting of up to eight capital letters in English and or digits Chinese Certifications Network access licensing NAL The Ministry of Information Industry MII former Ministry of Posts and Telecommunications ...

Page 71: ...d China Telecommunications Equipment Network Access Approval TENAA or CTA or China Telecommunications Equipment Network Access Licensing NAL NAL marks should meet the following requirements NAL marks are the quality compliance marks affixed to the telecommunications equipment that obtains network access licenses NAL marks are printed and issued by the MII NAL marks can be purchased for the equipme...

Page 72: ...ple s Republic of China MIIT issued the Notice of Strengthening Management of Radio Transmission Equipment As stipulated in the provisions and notice manufacturers of all radio transmission equipment sold in China should possess the China Radio Transmission Equipment Approval Certificate issued by the SRRC and the relevant CMIIT ID should be affixed to the equipment nameplates Telecommunication eq...

Page 73: ... and non standard marks Huawei products use non standard CCC marks RoHS REACH JGPSSI and Chinese Environmental Protection RoHS the restriction of the use of certain hazardous substances in electrical and electronic equipment According to RoHS directive all electrical and electronic products sold on the EU market should be free of the following six hazardous substances as of July 1 2006 lead Mercur...

Page 74: ...tances in products in July 2003 The JGPSSI divides the management of chemicals into the following three processes Acquisition of content information for purchased materials IN information Obtain content information IN information for each substance preparation and each article and confirm the reliability of the content information Manufacture of products using those materials in a manufacturing pr...

Page 75: ...oducts that contain toxic or hazardous substances or elements The user manuals of the products should indicate the names and contents of the toxic or hazardous substances or elements The number in the middle of the mark indicates the safety period of the specific product The safety period of a product will be determined in accordance with the General Guidelines of Environment Friendly Use Period o...

Page 76: ...d accept either certification as one of the market entry conditions 7 5 1 GCF Certification The GCF is an active partnership between European mobile device manufacturers and mobile network operators According to the R TTE Directive 1999 95 EC issued in 2001 authorized test organizations or manufacturers should perform final conformance tests of GSM terminals in compliance with the GCF certificatio...

Page 77: ...eclare that the terminals do not support the related features and not claim that the terminals support the related features when releasing the terminals to the market Unnecessary tests The GCF does not require the terminals to pass all the tests specified by the 3GPP OMA or IMTC The tests that are not relevant need not to be performed As the GCF test items need to be updated frequently to meet the...

Page 78: ...of the PTCRB certification OTA tests are adopted to measure the antenna performance The PTCRB test items and version are also updated continuously Different from the GCF CC version only one PTCRB version is valid at any time Each PTCRB version is valid for three months Manufacturers are not allowed to apply for the previous version of PTCRB certification if a new version is released For a terminal...

Page 79: ...organization can issue a certification report of the integrated equipment after performing the required field test and SIM USIM test based on the test report provided by Huawei Terminal manufacturers who apply for the GCF certification of the terminals to be integrated with Huawei modules must accomplish the following tasks 1 Register as a member of the GCF The GCF certification is a DOC Only GCF ...

Page 80: ...ult in changes in the electrical features of the USIM card interface For this reason the USIM card interface circuits need to be re tested The SIM USIM test aims to verify the overall performance of SIM USIM interface with appropriate test instruments in accordance with the relevant 3GPP protocol requirements Similar to the GCF certification the PTCRB certification requires a small number of test ...

Page 81: ...tions are rejected even though all the required tests are performed 5 Perform overall system certification The integrated equipment can pass the over all certification test easily if Huawei s design suggestions are complied with 6 Obtain the test report and submit relevant materials The PTCRB test report is provided by the test organization The terminal manufacturer however is required to provide ...

Page 82: ...sult your service provider Pacemaker manufacturers recommend that a minimum distance of 15 cm be maintained between the wireless device and a pacemaker to prevent potential interference with the pacemaker If you are using an electronic medical device consult the doctor or device manufacturer to confirm whether the radio wave affects the operation of this device 8 3 Area with Inflammables and Explo...

Page 83: ...s and regulations of airline companies When boarding or approaching a plane power off your wireless device Otherwise the radio signal of the wireless device may interfere with the plane control signals 8 6 Safety of Children Do not allow children to use the wireless device without guidance Small and sharp components of the wireless device may cause danger to children or cause suffocation if childr...

Page 84: ...ce with a considerably low or high temperature Use only accessories of the wireless device approved by the manufacture Contact the authorized service center for any abnormity of the wireless device or accessories Do not dismantle the wireless device or accessories Otherwise the wireless device and accessories are not covered by the warranty 8 12 Emergency Call This wireless device functions throug...

Page 85: ... and certified to the FCC that it does not exceed the limit established by the government adopted requirement for safe exposure The SAR limit adopted by the USA and Canada is 1 6 watts kilogram W kg averaged over one gram of tissue The highest SAR value reported to the FCC for this device type was compliant with this limit 8 14 2 FCC Statement This device complies with Part 15 of the FCC Rules Ope...

Page 86: ...lues should be adjusted according to actual PCB layout and routings SLEEP_STATUS GPIO2 41 44 17 16 6 69 65 72 15 14 22 21 19 18 55 54 56 57 58 59 46 45 26 28 30 37 36 35 33 34 13 48 53 31 9 12 11 2 10 8 27 29 25 20 7 5 1 3 24 23 51 52 49 38 40 42 43 39 75 76 77 78 60 4 32 47 50 61 62 63 64 66 67 68 70 71 73 74 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103 104 105 1...

Page 87: ...SOUT_N LED_STATUS LED_MODE RESOUT_N_AP WAKEUP_OUT_N_AP WAKEUP_OUT WAKEUP_IN_AP WAKEUP_IN VCC_EXT1_1V8 RESIN_N_AP RESIN_N ON2_N O2N_AP V_ON1 VBAT_PMU VBAT_PMU C302 33PF 100NF C303 1 3 2 Q308 1 3 2 Q303 2 2K R311 1 3 2 Q301 R303 220K 100NF C305 100NF C304 R302 220K 100K R312 1 3 2 Q306 1 3 2 Q305 R310 2 2K R307 10K R308 10K 1 2 3 Q304 C301 33PF 2 1 D2 R316 200 2 1 D1 R301 2 2K R309 100K R306 2 2K B ...

Page 88: ... access EBU External Bus Unit EIA Electronic Industries Association EMC Electromagnetic Compatibility ESD Electrostatic Discharge EU European Union FCC Federal Commnications Commission FDD TDMA Frequency Division Duplexing time Division Multiple Access GMSK Gaussian MinimumSshift Keying GPIO General purpose I O GPRS General Packet Radio Service GSM Global System for Mobile communication HSIC High ...

Page 89: ...Multi chip Package MIPI Mobile Industry Processor Interface NTC Negative Temperature Coefficient PA Power Amplifier PBCCH Packet Broadcast Control Channel PCB Printed Circuit Board PDU Protocol Data Unit PMU Power Management Unit RF Radio Frequency RoHS Restriction of the Use of Certain Hazardous Substances RTC Real time Clock TTL Transistor transistor Logic TVS Transient Voltage Suppressor UMTS U...

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