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HUAWEI MG301 B2B Module

HardwareGuide

Appendix B Acronyms and Abbreviations

Appendix B Acronyms and Abbreviations

Acronym or Abbreviation

Expansion

B2B

Board-to-Board

European Conformity

Coding Scheme

CSD

Circuit Switched Data

Direct Current

DCE

Data Circuit-terminating Equipment

DMA

Direct Memory Access

DTE

Data Terminal Equipment

EMC

Electromagnetic Compatibility

ESD

Electrostatic Discharge

European Union

FCC

Federal Communications Commission

FDD-TDMA

Frequency Division Duplexing–time Division Multiple

Access

GMSK

Gaussian Minimum Shift Keying

GPRS

General Packet Radio Service

ISO

International Standards Organization

LCP

Liquid Crystal Polyester

LDO

Low-Dropout

LED

Light-emitting Diode

MCP

Multi-chip Package

NTC

Negative Temperature Coefficient

Huawei Technologies Co., Ltd

Issue 06 (2013-06-13)

Huawei Technologies Co., Ltd

Issue 06 (2013-06-13)

Summary of Contents for MG301

Page 1: ...HUAWEI MG301 B2B Module Hardware Guide Issue 06 Date 2014 06 20 ...

Page 2: ...e a nd company names mentioned ar e t he pr operty of t heir r espective owners Notice Some features of the product and its accessories described herein rely on the software installed capacities and s ettings of l ocal network and m ay not be activated or m ay be l imited b y l ocal n etwork oper ators o r network service providers thus the descriptions herein may not exactly match the product or ...

Page 3: ...ce 13 3 3 Power Interface 16 3 3 1 Overview 16 3 3 2 VBAT Interface 17 3 3 3 VCOIN Interface 18 3 3 4 VIO Interface 18 3 4 Power On and Power Off Time Sequence 18 3 4 1 Overview 18 3 4 2 Power On Time Sequence 19 3 4 3 Power Off Time Sequence 20 3 4 4 RESET 20 3 5 Signal Control Interface 20 3 5 1 Overview 20 3 5 2 Input Signal Control Pins 21 3 5 3 Output Signal Control Pin 22 3 6 UART Interface ...

Page 4: ... and Storage Temperatures and Humidity 36 5 4 Electrical Criteria of Application Interfaces 36 5 5 Power Supply Features 40 5 5 1 Input Power Supply 40 5 5 2 Working Current 40 5 6 Reliability Features 42 5 7 ESD Features 44 6 Mechanical Specifications 45 6 1 Overview 45 6 2 Dimensions 45 6 3 Dimensions of the B2B Connector 46 6 4 MG323 Module Installation Description 48 6 5 Specification Selectio...

Page 5: ...i MG301 B2B module hereinafter referred to as the MG323 module is used The MG301 B2B module can pin to pin replace MG323 module This document helps you to understand the interface specifications electrical features and related product information of the MG301 B2B module MG301 B2B Front MG301 B2B Back Huawei Proprietary and Confidential Copyright Huawei Technologies Co Ltd Issue 06 2013 06 13 ...

Page 6: ...rking bands Four supported frequency bands GSM850 MHz 900 MHz 1800 MHz 1900 MHz Maximum transmission power GSM850 Class 4 2 W EGSM900 Class 4 2 W DCS1800 Class 1 1 W PCS1900 Class 1 1 W Receiver sensitivity 107 dBm Operating Temperature Normal operating temperature 20 C to 70 C Extended operating temperature 1 40 C to 85 C Ambient temperature for storage 40 C to 85 C Power voltage 3 3 V to 4 8 V 3...

Page 7: ...face Antenna interface Hirose U FL R SMT 1 80 50 Ω antenna connector Antenna pad Voice services Two analog voice channels SMS New message alert text message receiving and text message sending Management of text messages read messages delete messages storage status and message list Support for the protocol data unit PDU mode GPRS GPRS CLASS 10 Encoding schemes CS 1 CS 2 CS 3 and CS 4 Maximum downli...

Page 8: ...ures outside of the range 20 C to 70 C the module might slightly deviate from 3GPP TS 45 005 specifications 2 3 Application Block Diagram Figure 2 1 shows the application block diagram of the MG301 B2B module Figure 2 1 Application block diagram of the MG301 B2B module 2 4 Circuit Block Diagram The circuit block diagram and major functional units of the MG301 B2B module contain the following parts...

Page 9: ...ent Multi chip package MCP memory Radio frequency RF transceiver 26 MHz clock 32 kHz clock RF front end modules Receive filter Figure 2 2 Circuit block diagram of the MG301 B2B module Huawei Proprietary and Confidential Copyright Huawei Technologies Co Ltd Issue 06 2013 06 13 ...

Page 10: ... UART Interface SIM Card Interface Audio Interface USB Interface 3 2 B2B Connector Interface The MG301 B2B module uses a 50 pin B2B connector as its external interface For details about the model and dimensions of the B2B connector see 6 3 Dimensions of the B2B Connector Figure 3 1 shows the sequence and definitions of pins on the 50 pin B2B signal interface of the MG301 B2B module Figure 3 1 Sequ...

Page 11: ...90 6 EXTEAR_P AO Positive pole of the output of headset speaker 7 SIM_RST O Reset signal of the SIM card 1 80 2 90 8 EXTEAR_N AO Negative pole of the output of headset speaker 9 NC Not connected please keep this pin open 10 INTMIC_N AI Negative pole of the input of handset microphone 11 NC N ot connected 12 INTMIC_P AI Positive pole of the input of handset microphone 13 NC Not connected please kee...

Page 12: ...ication 0 40 2 80 3 20 26 NC Not connected please keep this pin open 27 NC Not connected please keep this pin open 28 UART1_CTS O DCE clear to send 0 40 2 85 3 25 29 UART1_RD O DCE transmit data 0 40 2 85 3 25 30 NC Not connected please keep this pin open 31 NC Not connected please keep this pin open 32 UART1_DTR I DCE data terminal ready 0 40 2 80 3 20 33 UART1_TD I DCE receive data 0 40 2 80 3 2...

Page 13: ...ins for digital signal input O indicates pins for digital signal output AI indicates pins for analog signal input AO indicates pins for analog signal input The NC Not Connected pins are internally connected to the module Therefore these pins should not be used otherwise they may cause problems Please contact us for more details about this information 3 3 Power Interface 3 3 1 Overview The power su...

Page 14: ...ak value of about 2 0 A due to the differences in actual network environments In this case the VBAT voltage greatly drops Make sure that the voltage does not decrease below 3 3 V in any case Otherwise exceptions such as restart of the MG301 B2B module may occur A low dropout LDO regulator or switch power with current output of more than 2 A is recommended for external power supply Furthermore At l...

Page 15: ...3 8 V the charging current is about 0 6 mA typical value Figure 3 3 shows two types of circuits for your reference Figure 3 3 VCOIN interface circuit 3 3 4 VIO Interface Through the VIO interface the MG301 B2B module can supply 2 8 V power externally with an output current of 10 mA typical value for external level conversion or other applications If the MG301 B2B module is in sleep mode the VIO in...

Page 16: ...plication interfaces must be powered on after the module is powered on You can power on the MG301 B2B module through the TERM_ON interface The software will report relevant information according to the actual settings after the module is powered on For example the AT command automatically reports SYSSTART 1 In this case the external VIO interface is enabled and supplies 2 8 V power 1 For specific ...

Page 17: ... the VBAT power when the module is working It is recommended to power off the module before turning off the VBAT power 3 4 4 RESET The MG301 B2B module supports hardware reset function If the software of the MG301 B2B module stops responding you can reset the hardware through the RESET signal After the hardware is reset the software starts powering on the module and reports relevant information ac...

Page 18: ...pulled down for 1 second to 2 seconds again the module is powered off The RESET pin is used to reset the hardware When the software stops responding the RESET pin can be pulled down for at least 10 ms to reset the hardware As the RESET and TERM_ON signals are relatively sensitive it is recommended that you install a 10 nF capacitor near the RESET and TERM_ON pins of the B2B interface for filtering...

Page 19: ...D_STATUS Pin Sleep mode A low level signal is output continuously Network searching or non network status including the case when the SIM card is not inserted and the case when the PIN number is unblocked A high level signal is output for 0 1s in a period of 1s Registered with a 2G network A high level signal is output for 0 1s in a period of 3s GPRS data service A high level signal is output for ...

Page 20: ... The UART1 has the following features Full duplex Baud rate clock generated by the system clock Direct memory access DMA transmission Baud rate ranging from 9600 bit s to 230400 bit s 115200 bit s by default Self adapted baud rate ranging from 9600 bit s to 115200 bit s Table 3 6 lists the UART1 interface signals Table 3 6 UART1 interface signals Pin No Signal Name Description Feature Direction 29...

Page 21: ...eady The DCE is ready DCE to DTE 28 UART1_CTS DCE clear to send The DCE has switched to the data receiving mode DCE to DTE 24 UART1_DCD DCE data carrier detect A data link is set up DCE to DTE 3 6 2 Circuit Recommended for the UART Interface Figure 3 8 shows the connection of the UART1 interface in the MG301 B2B module DCE with the host DTE Figure 3 8 Connection of the UART1 interface in the MG301...

Page 22: ...refore if the UART signals need to be connected the signal with 3 3 V a level conversion curcuit is required UART1 interface must be powered on after the module is powered on to avoid the wind blow in which may cause the module cannot work properly The level of RS 232 Transceivers must match that of the MG301 B2B module 3 7 SIM Card Interface 3 7 1 Overview The MG301 B2B module provides a SIM card...

Page 23: ...d socket you need to place a SIM card socket on the user interface board The SIM card signals are transmitted outwards through the 50 pin B2B connector interface Figure 3 11 shows the circuit of the SIM card interface Figure 3 11 Circuit of the SIM card interface ESD protection HUAWEI Module Modem VSIM SIM_RST SIM_CLK SIM_DATA GND SIM Card Socket 33 pF 33 pF 1 1F 33 pF Huawei Proprietary and Confi...

Page 24: ... to pull the SIM_DATA pin up during design as a 15 kΩ resistor is used to connect the SIM_DATA pin to the VSIM pin It is recommended to take electrostatic discharge ESD protection measures near the SIM card socket The TVS diode with Vrwm of 5 V and junction capacitance less than 10 pF must be placed as close as possible to the SIM socket and the Ground pin of the ESD protection component is well c...

Page 25: ...ed that ESD components be added to the external circuit of the audio interface to protect the module 3 9 USB Interface The MG301 B2B module support USB2 0 interface reserved for debug suggest to lift 2 test point The USB interface on MG301 LCC module pin48 pin49 Pin No Signal Name Description Feature Direction USB_D USB_D inferface debug information output USB_D USB_D inferface debug information o...

Page 26: ...01 B2B module works properly only one antenna connection method can be used otherwise the RF performance may deteriorate If a buckled RF connector is used it is recommended that you use a 50 Ω coaxial cable in the U FL series The height of the connector increases by 0 8 mm when this cable is used If an antenna pad is used you need to connect the coaxial cable core to the pad In addition you need t...

Page 27: ...nnector dimensions Figure 4 1 RF connector dimensions Table 4 1 lists the major specifications of the RF connector Table 4 1 Major specifications of the RF connector Rated Condition Environmental Condition Type Material Frequency range Direct current DC to 6 GHz Temperature range 40 C to 90 C Shell Phosphor and copper plated with silver Characteristic impedance 50 Ω Cable core Gold plated copper w...

Page 28: ... the coaxial cable working with the RF connector Figure 4 2 Specifications of the coaxial cable working with the RF connector You can visit http www hirose com for more detailed information about the coaxial cable working with the RF connector Figure 4 3 shows the connection between the RF connector and the U FL LP 040 cable Figure 4 3 Connection between the RF connector and the U FL LP 040 cable ...

Page 29: ...ended that you pay attention to the junction capacitance of the TVS diode when you choose the model of the TVS diode Ensure that the junction capacitance of the TVS diode is lower than 1 pF 4 5 RF Specifications of the Antenna Interface Table 4 2 lists the RF specifications of the antenna interface in the MG301 B2B module Table 4 2 RF specifications of the antenna interface in the MG301 B2B module...

Page 30: ...32 dBm Number of carrier frequencies GSM 850 124 E GSM 900 174 GSM 1800 374 GSM 1900 299 Duplex spacing GSM 850 25 MHz E GSM 900 45 MHz GSM 1800 95 MHz GSM 1900 80 MHz Carrier spacing 200 kHz Multiplex and duplex modes Frequency division duplexing time division multiple access FDD TDMA Time slots of each TDMA frame 8 Frame duration 4 615 ms Time slot duration 577 µs Modulation scheme Gaussian mini...

Page 31: ...commended specifications of the antenna interface Working bands 824 MHz 960 MHz and 1710 MHz 1990 MHz Port impedance 50 Ω Voltage standing wave ratio VSWR 3 1 Maximum gain 2 5 dBi Antenna efficiency 40 824 MHz 960 MHz 50 1710 MHz 1990 MHz Polarization Linear polarization Pattern Omnidirectional Huawei Proprietary and Confidential Copyright Huawei Technologies Co Ltd Issue 06 2013 06 13 ...

Page 32: ...Features Reliability Features ESD Features 5 2 Extreme Working Conditions Table 5 1 lists the extreme working conditions for the MG301 B2B module Using the MG301 B2B module beyond these conditions may result in permanent damage to the module Table 5 1 Extreme working conditions for the MG301 B2B module Symbol Specification Minimum Value Maximum Value Unit VBAT External power voltage 0 40 6 00 V VC...

Page 33: ...mperatures 1 40 20 C Extended temperatures 1 70 85 C Ambient temperature for storage 40 85 C Moisture 5 95 1 The temperatures outside of the range 20 C to 70 C the module might slightly deviate from 3GPP TS 45 005 specifications 5 4 Electrical Criteria of Application Interfaces Table 5 3 lists the sequence numbers of pins and definitions of signals on the 50 pin B2B interface of the MG301 B2B modu...

Page 34: ...s typical values measured when no external device is connected to the MG301 B2B module through the 50 pin B2B interface Table 5 4 Electrical features of application interfaces Function Signal Name I O Waveform and Level Remarks Power supply interface VBAT P VI 3 30 V to 4 80 V VItypical 3 80 V Pins 42 44 46 48 and 50 are power supply pins used to supply the MG301 B2B module with power When the mod...

Page 35: ...the RTC When the VBAT is not ready for power supply the RTC can be supplied with power through an external coin battery or capacitor This pin can be left openif it is not used Power pin TERM_ON I VILmax 0 40 V The signal can be detected when low level keeps effective for one second or more Pin 20 is a pin for powering on the module Low level is effective Reset pin RESET I VILmax 0 40 V The signal ...

Page 36: ...6V Clock signal of the SIM card VSIM P VoHmax 1 95 V Votype 1 80 V VoHmin 1 65 V Power voltage of the SIM card GND GND of the SIM card UART1 UART1_RD O VoLmax 0 10 V This interface can be used to transmit AT communicatio VoHmin 2 70 V commands and data UART1_TD I n interface VILmax 0 40 V UART1_RIN G O VIHmin 2 40 V UART1_DSR O UART1_RTS I UART1_DTR I UART1_CTS O UART1_DCD O Analog audio interface...

Page 37: ... 26 27 30 31 and 39 are internal pins These pins need to be left floating when they are used P indicates power pins I indicates pins for digital signal input O indicates pins for digital signal output AI indicates pins for analog signal input AO indicates pins for analog signal output 5 5 Power Supply Features 5 5 1 Input Power Supply Table 5 5 lists the requirements for input power of the MG301 B...

Page 38: ...al values are the average of some test samples In idle mode the module is registered to the network no voice or data service is ongoing and the serial port can be used Table 5 7 Working current of the MG301 B2Bmodule for GPRS mode Band Typical value Unit PCL Configuration GPRS850 242 mA 5 1 Up 1 Down 438 2 Up 1 Down 136 mA 10 1 Up 1 Down 220 2 Up 1 Down GPRS900 252 mA 5 1 Up 1 Down 455 2 Up 1 Down...

Page 39: ...emperature storage Temperature 40ºC 2ºC Test duration 24 h IEC60068 High temperature storage Temperature 85ºC 2ºC Test duration 24 h IEC60068 Low temperature working Temperature 30ºC 2ºC Test duration 24 h IEC60068 High temperature working Temperature 75ºC 2ºC Test duration 24 h IEC60068 Damp heat cycling High temperature 55ºC 2ºC Low temperature 25ºC 2ºC Humidity 95 Repetition times 4 Test durati...

Page 40: ...e temperature of 35 C 16 h IEC60068 Sun exposure Radiation strength 1120 W m2 Duration 20 h Repetition time 3 IEC60068 Sine vibration Frequency range 5 Hz to 200 Hz Acceleration 10 m s2 Frequency scan rate 1 oct min Test period 3 axial directions Five circles for each axial direction IEC60068 Shock test Half sine wave shock Peak acceleration 300 m s2 Shock duration 11 ms Test period 6 axial direct...

Page 41: ...is connected to the MG301 B2B module and user interface board properly you are recommended not to spray a coated insulation on the structure fixing hole connecting with the main reference GND of the user interface board and connect the hole with the MG301 B2B module through the metal fastener or other low resistance fastener For specific installation method and fastener specification see 6 4 MG301...

Page 42: ...he MG301 B2B module including Dimensions Dimensions of the B2B Connector MG301 B2B Module Installation Description Specification Selection for Fasteners 6 2 Dimensions Dimensions L x W x H 35 mm x 32 5 mm x 3 05 mm Figure 6 1 shows the dimensions Weight 5 8 g Huawei Proprietary and Confidential Copyright Huawei Technologies Co Ltd Issue 06 2013 06 13 ...

Page 43: ...connector whose model is DF12C 3 0 50DS 0 5V 81 and whose pin spacing is 0 5 mm to work with the connector DF12E 3 0 50DP 0 5V 81 of the DF12 series both connectors are manufactured by Hirose For specific models access http www hirose com Figure 6 2 DF12C manufactured by Hirose used on the MG301 B2B module Huawei Proprietary and Confidential Copyright Huawei Technologies Co Ltd Issue 06 2013 06 13...

Page 44: ... connector model and DF12 product series working with the MG301 B2B module Item Model Stacking Height mm HRS Number Connector model used with the MG301 B2B modu DF12C 3 0 50DS le 0 5V 81 3 0 537 0694 9 81 Connector model recommended to be used on the user interface board DF12E 3 0 50DP 0 5V 81 3 0 537 0834 6 Huawei Proprietary and Confidential Copyright Huawei Technologies Co Ltd Issue 06 2013 06 ...

Page 45: ...sprayed with a coated insulation and connected with the main reference GND of the module as shown in Figure 6 5 Figure 6 5 Structure fixing hole You can insert machine screws through the structure fixing holes and metal fasteners and fasten with nuts to firmly connect the MG301 B2B module to the user interface board 1 The metal fastener is placed between the MG301 B2B module and user interface Hua...

Page 46: ...lation 1 Pay great attention to ESD protection when using the MG301 B2B module To ensure that the working reference GND is connected to the MG301 B2B module and user interface board properly you are recommended not to spray a coated insulation on the structure fixing hole connecting with the main reference GND of the user interface board and connect the hole with the MG301 B2B module through the m...

Page 47: ...u use the M1 6 or M1 8 machine screw You can also customize the screws The fastener components in the following figures are recommended The machine screw dimensions are M1 6 7 5 3 0 1 0 It is recommended that you plate gold on the metal fastener Figure 6 7 shows the specific dimensions for the fastener components Figure 6 7 Machine screw dimensions Huawei Proprietary and Confidential Copyright Hua...

Page 48: ...G301 B2B Module Hardware Guide Mechanical Specifications Figure 6 8 Nut dimensions Figure 6 9 Metal fastener dimensions Huawei Proprietary and Confidential Copyright Huawei Technologies Co Ltd Issue 06 2013 06 13 ...

Page 49: ...Appendix A Circuits of Typical Interfaces 7 Appendix A Circuits of Typical Interfaces Figure 7 1 Circuits of typical interfaces in the MG301 B2B module Huawei Proprietary and Confidential Copyright Huawei Technologies Co Ltd Issue 06 2013 06 13 ...

Page 50: ...ty ESD Electrostatic Discharge EU European Union FCC Federal Communications Commission FDD TDMA Frequency Division Duplexing time Division Multiple Access GMSK Gaussian Minimum Shift Keying GPRS General Packet Radio Service ISO International Standards Organization LCP Liquid Crystal Polyester LDO Low Dropout LED Light emitting Diode MCP Multi chip Package NTC Negative Temperature Coefficient Huawe...

Page 51: ...otocol Data Unit RF Radio Frequency RoHS Restriction of the Use of Certain Hazardous Substances RTC Real time Clock SIM Subscriber Identity Module TTL Transistor transistor Logic TVS Transient Voltage Suppressor UART Universal Asynchronous Receiver transmitter VSWR Voltage Standing Wave Ratio Huawei Proprietary and Confidential Copyright Huawei Technologies Co Ltd Issue 06 2013 06 13 ...

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