HUAWEI ME909s Series LTE Mini PCIe Module
Hardware Guide
Electrical and Reliability Features
Issue 02 (2016-09-07)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
57
Item
Test Condition
Standard
Sample size Results
Temperature
cycle
High temperature:
85ºC
Low temperature:
–40ºC
Temperature change
slope: 6ºC/min
Operation mode: no
power
Test duration: 168 h,
336 h, 500 h for
inspection point
JESD22-
A104-C
50 pcs/group Visual inspection: ok
Function test: ok
RF specification: ok
Cross section: ok
ESD
HBM (Human
Body Model)
2 kV (Class 1B)
Operation mode: no
power
JESD22-
A114-D
3 pcs/group
Visual inspection: ok
Function test: ok
RF specification: ok
ESD with DVK (or
embedded in the
host)
Contact and Air
discharges: 10
positive and 10
negative applied
Contact Voltage: ±2
kV, ±4 kV
Air Voltage : ±2 kV, ±4
kV, ±8 kV
Operation mode:
working with service
connected
IEC61000
-4-2
2 pcs
Visual inspection: ok
Function test: ok
RF specification: ok
Groups
≥ 2
5.6 EMC and ESD Features
The following are the EMC design comments:
Attention should be paid to static control in the manufacture, assembly, packaging,
handling, storage process to reduce electrostatic damage to HUAWEI module.
RSE (Radiated Spurious Emission) may exceed the limit defined by EN301489 if
the antenna port is protected by TVS (Transient Voltage Suppressor), which is
resolved by making some adjustment on RF match circuit.
TVS should be added on the USB port for ESD protection, and the parasitic
capacitance of TVS on D+/D- signal should be less than 2 pF. Common-mode
inductor should be added in parallel on D+/D- signal.
TVS should be added on the USIM interface for ESD protection. The parasitic
capacitance of TVS on USIM signal should be less than 10 pF.