Doc. No.
DOC-00045404 REV.
Issued Date
2008/08/18
Revised Date
2008/08/15
A01
Doc. Title
SkyWriter Service Manual
Page
83 of 83
HTC confidential
© 2008 HTC CORPORATION. ALL RIGHTS RESERVED.····························································
TOTAL 83 PAGE NO. 83
宏達國際電子股份有限公司
HTC Corporation
3. Use small soldering iron to remove remaining underfill, then use chemistry liquid of
Acetone to clear the CSP surface of PCB.
4. All the remaining underfill be cleared, the CSP can be re-solder in place.
5. Send the PCB to Underfill machine to do re-underfill.
Use small soldering
iron to remove
remaining
Use Acetone to clear
the CSP surface of
PCB
