Doc. No.
DOC-00045404 REV.
Issued Date
2008/08/18
Revised Date
2008/08/15
A01
Doc. Title
SkyWriter Service Manual
Page
82 of 83
HTC confidential
© 2008 HTC CORPORATION. ALL RIGHTS RESERVED.····························································
TOTAL 83 PAGE NO. 82
宏達國際電子股份有限公司
HTC Corporation
Underfill re-work process
There are five components with underfill process, BU1,U1,U4, U345,U374 these component are
not suggested to be Re-worked, but if it is requested to do re-work, the following re-work process
must be followed –up.
1. Use the sharp hand of soldering iron to break the bridge of CSP.
2. After the Bridge be broken, Use
SMD rework station to remove CSP, the temperature must be
set in 2
10~240
℃
,there are a litter underfill remained on the surface of PCB.
Break Bridge
Remained Underfill
